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Name: XCR3256XL-10FTG256I
Brand: AMD Xilinx
SKU: XCR3256XL-10FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3256XL-10FTG256I

Part No.:: XCR3256XL-10FTG256I

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3256XL-10FTG256I.pdf

Description:: IC CPLD 256MC 9NS 256BGA

In Stock:: 3366

Quantity:: Add To Cart

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XCR3256XL-10FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9.1 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
164
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3256XL-10FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3256XL-10FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3256XL-10FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3256XL-10FTG256I information

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Common technical challenges and solutions when using XCR3256XL-10FTG256I

XCR3256XL-10FTG256I is a field-programmable gate array (FPGA) chip widely used in digital logic design and prototyping due to its high configurability and versatility.

Noise Issues:

To mitigate noise issues in designs employing XCR3256XL-10FTG256I, consider implementing proper grounding techniques and decoupling capacitors near power pins to suppress high-frequency noise. Additionally, optimize routing to minimize signal crosstalk and interference.

Power Consumption:

Reducing power consumption in XCR3256XL-10FTG256I-based designs can be achieved through power gating techniques, where unused portions of the FPGA can be powered down dynamically. Utilize low-power design strategies such as clock gating and voltage scaling to further optimize power efficiency.

Integration Complexity:

To address integration complexity with XCR3256XL-10FTG256I, utilize advanced design tools and methodologies such as hierarchical design, IP reuse, and modularization. Break down complex functionalities into smaller, manageable blocks, and use standardized interfaces for seamless integration.

Signal Integrity:

Ensuring signal integrity in XCR3256XL-10FTG256I-based designs requires careful consideration of transmission line effects, termination techniques, and signal routing guidelines. Perform signal integrity analysis using simulation tools to identify and mitigate signal integrity issues early in the design process.

Timing Closure:

Achieving timing closure with XCR3256XL-10FTG256I designs involves optimizing clock networks, balancing timing constraints, and employing advanced synthesis and place-and-route algorithms. Utilize constraints wisely and leverage floorplanning techniques to meet timing requirements efficiently.

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6. What is the process for return or replacement of XCR3256XL-10FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3256XL-10FTG256I we delivered, we will accept the replacement or return of the XCR3256XL-10FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3256XL-10FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations