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Name: XCR3256XL-10FTG256C
Brand: AMD Xilinx
SKU: XCR3256XL-10FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3256XL-10FTG256C

Part No.:: XCR3256XL-10FTG256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XCR3256XL-10FTG256C.pdf

Description:: IC CPLD 256MC 9NS 256BGA

In Stock:: 3411

Quantity:: Add To Cart

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XCR3256XL-10FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9.1 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
164
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3256XL-10FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3256XL-10FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3256XL-10FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3256XL-10FTG256C information

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Common technical challenges and solutions when using XCR3256XL-10FTG256C

XCR3256XL-10FTG256C is a versatile FPGA (Field-Programmable Gate Array) device commonly used in various electronic applications, offering high performance and flexibility in digital circuit design.

Technical Challenges:

When utilizing XCR3256XL-10FTG256C, engineers may encounter several technical challenges, including:

1. Noise Issues: FPGA designs often face challenges related to noise, which can affect signal integrity and system performance. Noise sources may include power supply fluctuations, signal crosstalk, or electromagnetic interference (EMI).

2. Power Consumption: XCR3256XL-10FTG256C devices may consume significant power, especially in complex designs or when operating at high frequencies. Managing power consumption is crucial to avoid overheating and ensure reliable operation.

3. Integration Complexity: Integrating XCR3256XL-10FTG256C into a system involves complex tasks such as design partitioning, routing, and timing closure. Managing the integration complexity is essential to meet performance and time-to-market requirements.

Solutions and Improvements:

To address these challenges, engineers can implement the following solutions and improvements:

1. Noise Mitigation Techniques: Employ proper PCB layout practices, such as minimizing trace lengths, using differential signaling, and placing decoupling capacitors strategically, to mitigate noise issues and enhance signal integrity.

2. Power Optimization: Utilize power management techniques such as clock gating, voltage scaling, and dynamic power management to optimize power consumption without compromising performance.

3. Advanced Synthesis and Place-and-Route Tools: Utilize advanced synthesis and place-and-route tools provided by FPGA vendors to optimize design placement, routing, and timing closure, thereby reducing integration complexity and improving design efficiency.

4. Simulation and Verification: Perform thorough simulation and verification using FPGA development tools to identify and address potential issues early in the design phase, ensuring robustness and reliability of the final implementation.

5. Design Reuse and IP Cores: Leverage pre-designed intellectual property (IP) cores and design reuse methodologies to streamline development, reduce integration effort, and accelerate time-to-market for XCR3256XL-10FTG256C-based projects.

Conclusion:

By implementing these solutions and improvements, engineers can overcome common technical challenges associated with XCR3256XL-10FTG256C FPGA devices, ensuring successful integration and optimal performance in electronic systems.

XCR3256XL-10FTG256C FAQ

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6. What is the process for return or replacement of XCR3256XL-10FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3256XL-10FTG256C we delivered, we will accept the replacement or return of the XCR3256XL-10FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3256XL-10FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations