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Name: XCR3256XL-10CSG280I
Brand: AMD Xilinx
SKU: XCR3256XL-10CSG280I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCR3256XL-10CSG280I

Part No.:: XCR3256XL-10CSG280I

Manufacturer:: AMD Xilinx

Package:: 280-TFBGA, CSPBGA

Datasheet:: XCR3256XL-10CSG280I.pdf

Description:: IC CPLD 256MC 9NS 280CSP

In Stock:: 2802

Quantity:: Add To Cart

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XCR3256XL-10CSG280I Specifications

Package/Case:
280-TFBGA, CSPBGA
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9.1 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
164
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3256XL-10CSG280I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3256XL-10CSG280I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3256XL-10CSG280I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3256XL-10CSG280I information

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Common technical challenges and solutions when using XCR3256XL-10CSG280I

XCR3256XL-10CSG280I is a field-programmable gate array (FPGA) with extensive logic capacity and versatile I/O capabilities, commonly used in high-performance computing and telecommunications applications.

Technical Challenges:

When using XCR3256XL-10CSG280I, several technical challenges may arise, including:

1. Noise Issues: High-frequency operation in XCR3256XL-10CSG280I circuits can lead to noise coupling, affecting signal integrity and overall system performance. Implementing proper decoupling capacitors and filtering techniques can mitigate noise.

2. Power Consumption: XCR3256XL-10CSG280I devices may consume significant power, especially in applications requiring intensive computation or continuous operation. Employing power-saving techniques such as clock gating and dynamic voltage scaling can help reduce overall power consumption.

3. Integration Complexity: Designing complex systems with XCR3256XL-10CSG280I involves integrating numerous components, interfaces, and peripherals, which can lead to increased design complexity and longer development cycles. Utilizing modular design practices and leveraging intellectual property (IP) cores can streamline integration efforts.

4. Timing Closure: Achieving timing closure, especially in large designs, can be challenging due to the intricate interconnection of logic elements and routing constraints in XCR3256XL-10CSG280I. Employing advanced synthesis and place-and-route optimization techniques, along with careful floorplanning, can help address timing issues and improve design performance.

5. Signal Integrity: High-speed interfaces and I/Os in XCR3256XL-10CSG280I designs are susceptible to signal integrity issues such as reflections, crosstalk, and jitter, which can degrade system reliability and functionality. Implementing signal integrity analysis tools and employing proper PCB layout practices, including controlled impedance traces and signal termination, can ensure robust signal integrity.

Solutions and Improvements:

To address these challenges, consider the following solutions and improvements:

- Noise Mitigation: Implementing proper PCB layout techniques, such as ground/power plane separation and signal isolation, can minimize noise coupling. Additionally, using low-noise power supplies and shielding sensitive components can further reduce noise interference.

- Power Optimization: Employing power-aware synthesis tools and optimizing clock domains can help reduce dynamic power consumption in XCR3256XL-10CSG280I designs. Furthermore, utilizing power gating techniques and implementing efficient power management schemes can enhance overall power efficiency.

- Integration Streamlining: Utilize pre-designed IP cores and modular design methodologies to simplify system integration with XCR3256XL-10CSG280I. Additionally, leveraging design reuse and abstraction layers can expedite development and reduce integration overhead.

- Timing Closure Techniques: Employ advanced synthesis optimizations, such as retiming and pipelining, to improve timing convergence in XCR3256XL-10CSG280I designs. Additionally, utilizing timing-driven placement and routing algorithms can help meet timing constraints more effectively.

- Signal Integrity Enhancement: Perform thorough signal integrity analysis during the design phase using simulation tools and high-speed PCB design guidelines. Incorporate signal integrity-aware routing techniques and utilize advanced signaling standards, such as LVDS or PCIe, to mitigate signal integrity challenges.

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6. What is the process for return or replacement of XCR3256XL-10CSG280I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3256XL-10CSG280I we delivered, we will accept the replacement or return of the XCR3256XL-10CSG280I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3256XL-10CSG280I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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