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Name: XCR3128XL-10VQ100I
Brand: AMD Xilinx
SKU: XCR3128XL-10VQ100I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3128XL-10VQ100I

Part No.:: XCR3128XL-10VQ100I

Manufacturer:: AMD Xilinx

Package:: 100-TQFP

Datasheet:: XCR3128XL-10VQ100I.pdf

Description:: IC CPLD 128MC 9.1NS 100VQFP

In Stock:: 3353

Quantity:: Add To Cart

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XCR3128XL-10VQ100I Specifications

Package/Case:
100-TQFP
Packaging:
Bulk
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9.1 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
8
NumberofMacrocells:
128
NumberofGates:
3000
NumberofI/O:
84
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3128XL-10VQ100I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3128XL-10VQ100I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3128XL-10VQ100I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3128XL-10VQ100I information

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Common technical challenges and solutions when using XCR3128XL-10VQ100I

XCR3128XL-10VQ100I is a field-programmable gate array (FPGA) device commonly used in various digital systems for its flexibility and reconfigurability. However, its utilization can present several technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

One common challenge with XCR3128XL-10VQ100I is noise interference, which can degrade signal integrity and affect overall system performance. To mitigate this, careful PCB layout design with proper grounding and signal routing techniques is crucial. Additionally, utilizing decoupling capacitors near power pins and employing noise filtering techniques can help suppress unwanted noise.

Power Consumption:

Another significant concern is power consumption, especially in battery-operated or power-sensitive applications. Implementing power-saving techniques such as clock gating, voltage scaling, and optimizing logic utilization can effectively reduce the power consumption of XCR3128XL-10VQ100I. Moreover, utilizing power management features provided by the FPGA and implementing dynamic power management schemes can further enhance power efficiency.

Integration Complexity:

The integration complexity of XCR3128XL-10VQ100I in a system design can also pose challenges, particularly in large-scale designs with numerous peripheral interfaces and complex interconnections. Utilizing hierarchical design methodologies, modularizing the design into manageable blocks, and employing advanced synthesis and optimization techniques can streamline the integration process. Additionally, utilizing IP cores and pre-verified design blocks can expedite development and reduce design complexity.

Clock Management:

Effective clock management is crucial for ensuring proper operation and timing closure in XCR3128XL-10VQ100I-based designs. Utilizing dedicated clocking resources efficiently, performing clock domain crossing analysis, and implementing clock tree synthesis techniques can help achieve robust clock distribution and minimize timing violations. Additionally, performing static timing analysis and optimizing critical paths can ensure reliable timing performance across the FPGA design.

Temperature Management:

Temperature fluctuations can impact the performance and reliability of XCR3128XL-10VQ100I, especially in harsh operating environments. Implementing thermal management techniques such as thermal vias, heat sinks, and thermal sensors can help dissipate heat effectively and maintain optimal operating temperatures. Moreover, monitoring temperature levels and dynamically adjusting FPGA operation parameters based on thermal feedback can prevent overheating and ensure long-term reliability.

XCR3128XL-10VQ100I FAQ

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6. What is the process for return or replacement of XCR3128XL-10VQ100I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3128XL-10VQ100I we delivered, we will accept the replacement or return of the XCR3128XL-10VQ100I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3128XL-10VQ100I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations