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Name: XCR3064XL-7VQG100C
Brand: AMD Xilinx
SKU: XCR3064XL-7VQG100C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3064XL-7VQG100C

Part No.:: XCR3064XL-7VQG100C

Manufacturer:: AMD Xilinx

Package:: 100-TQFP

Datasheet:: XCR3064XL-7VQG100C.pdf

Description:: IC CPLD 64MC 7NS 100VQFP

In Stock:: 2816

Quantity:: Add To Cart

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XCR3064XL-7VQG100C Specifications

Package/Case:
100-TQFP
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
7 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
4
NumberofMacrocells:
64
NumberofGates:
1500
NumberofI/O:
68
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XCR3064XL-7VQG100C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3064XL-7VQG100C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3064XL-7VQG100C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3064XL-7VQG100C information

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Common technical challenges and solutions when using XCR3064XL-7VQG100C

XCR3064XL-7VQG100C is a popular field-programmable gate array (FPGA) device known for its versatility and flexibility in various embedded system applications. However, like any complex integrated circuit, it presents several technical challenges that designers must address to ensure optimal performance and reliability.

Noise Issues:

One common challenge with XCR3064XL-7VQG100C is noise interference, which can degrade signal integrity and affect overall system performance. To mitigate this, designers can employ proper signal conditioning techniques such as shielding sensitive signal traces, using low-noise voltage regulators, and implementing filtering components like capacitors and inductors to suppress noise.

Power Consumption:

Another critical aspect is power consumption. XCR3064XL-7VQG100C devices often operate in power-constrained environments, making efficient power management crucial. Designers can optimize power usage by carefully selecting clock frequencies, disabling unused peripherals or logic blocks, and implementing power-saving modes when feasible.

Integration Complexity:

With increasing integration complexity in modern embedded systems, integrating XCR3064XL-7VQG100C effectively into the overall system architecture poses a significant challenge. To address this, designers should adopt a modular and systematic approach to system design, carefully partitioning functionality into manageable blocks and utilizing appropriate communication protocols and interfaces for seamless integration.

Firmware Optimization:

Firmware optimization is crucial for maximizing the performance of XCR3064XL-7VQG100C-based systems. Designers should employ efficient coding practices, utilize hardware accelerators and parallel processing capabilities within the FPGA, and optimize algorithms to minimize resource utilization and improve overall system responsiveness.

Thermal Management:

Thermal management is another concern, especially in applications where XCR3064XL-7VQG100C devices operate in harsh environments or under heavy computational loads. Proper heat sinking, airflow design, and thermal simulation techniques can help dissipate heat effectively and prevent thermal-induced performance degradation or reliability issues.

Conclusion:

In summary, while XCR3064XL-7VQG100C offers immense flexibility and capability for embedded system designs, addressing challenges such as noise, power consumption, integration complexity, firmware optimization, and thermal management is crucial to ensure reliable and high-performance operation in real-world applications.

XCR3064XL-7VQG100C FAQ

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6. What is the process for return or replacement of XCR3064XL-7VQG100C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3064XL-7VQG100C we delivered, we will accept the replacement or return of the XCR3064XL-7VQG100C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3064XL-7VQG100C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations