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Name: XCR3032XL-10VQ44I
Brand: AMD Xilinx
SKU: XCR3032XL-10VQ44I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XCR3032XL-10VQ44I

Part No.:: XCR3032XL-10VQ44I

Manufacturer:: AMD Xilinx

Package:: 44-TQFP

Datasheet:: XCR3032XL-10VQ44I.pdf

Description:: IC CPLD 32MC 9.1NS 44VQFP

In Stock:: 2758

Quantity:: Add To Cart

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XCR3032XL-10VQ44I Specifications

Package/Case:
44-TQFP
Packaging:
Tray
Series:
CoolRunner XPLA3
ProductStatus:
Active
ProgrammableType:
In System Programmable (min 1K program/erase cycles)
DelayTimetpd(1)Max:
9.1 ns
VoltageSupply-Internal:
2.7V ~ 3.6V
NumberofLogicElements/Blocks:
2
NumberofMacrocells:
32
NumberofGates:
750
NumberofI/O:
36
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XCR3032XL-10VQ44I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCR3032XL-10VQ44I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCR3032XL-10VQ44I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCR3032XL-10VQ44I information

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Common technical challenges and solutions when using XCR3032XL-10VQ44I

XCR3032XL-10VQ44I is a field-programmable gate array (FPGA) device commonly used in digital circuit design for its versatility and reconfigurability. However, its integration into complex systems can pose several technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

One common challenge with XCR3032XL-10VQ44I is managing noise within the system. This can arise from various sources such as power supply fluctuations, signal coupling, or high-frequency switching activities within the FPGA. To mitigate noise issues, proper power decoupling techniques should be employed, including strategically placing decoupling capacitors near the power pins of the FPGA. Additionally, careful routing of high-speed signals and separating noisy signals from sensitive ones on the PCB layout can help minimize noise coupling.

Power Consumption:

Another challenge is managing power consumption, especially in battery-powered or energy-efficient applications. Techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) can be implemented to reduce the power consumption of the XCR3032XL-10VQ44I during periods of low activity or when maximum performance is not required. Additionally, optimizing the FPGA's logic and resource utilization can help reduce overall power consumption while maintaining desired functionality.

Integration Complexity:

Integrating XCR3032XL-10VQ44I into complex systems can introduce challenges related to system complexity and resource utilization. Careful architectural design and partitioning of the FPGA resources are essential to efficiently utilize the available logic elements, memory blocks, and routing resources. Additionally, employing advanced synthesis and optimization techniques can help maximize resource utilization and minimize design complexity, leading to better performance and faster time-to-market.

Clock Management:

Managing clocks effectively is crucial for ensuring proper operation and timing closure in FPGA designs. Clock domain crossing issues, clock skew, and jitter can impact the overall system performance and reliability. Implementing proper clock tree synthesis techniques, including clock domain crossing circuits, phase-locked loops (PLLs), and clock skew optimization, can help address these challenges and ensure robust clock distribution throughout the XCR3032XL-10VQ44I-based system.

Signal Integrity:

Ensuring signal integrity is vital for reliable operation of XCR3032XL-10VQ44I-based systems, especially in high-speed designs. Signal integrity issues such as reflections, crosstalk, and impedance mismatches can degrade the quality of signals and lead to timing violations or data errors. Proper PCB layout techniques, including controlled impedance traces, signal shielding, and differential signaling, should be employed to minimize signal integrity issues and ensure robust communication within the system.

XCR3032XL-10VQ44I FAQ

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3. Are the XCR3032XL-10VQ44I price and inventory displayed accurate?

The price and inventory of XCR3032XL-10VQ44I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCR3032XL-10VQ44I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCR3032XL-10VQ44I we delivered, we will accept the replacement or return of the XCR3032XL-10VQ44I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCR3032XL-10VQ44I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations