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Name: XCKU3P-1FFVD900E
Brand: AMD Xilinx
SKU: XCKU3P-1FFVD900E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCKU3P-1FFVD900E

Part No.:: XCKU3P-1FFVD900E

Manufacturer:: AMD Xilinx

Package:: 900-BBGA, FCBGA

Datasheet:: XCKU3P-1FFVD900E.pdf

Description:: IC FPGA 304 I/O 900FCBGA

In Stock:: 2487

Quantity:: Add To Cart

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XCKU3P-1FFVD900E Specifications

Package/Case:
900-BBGA, FCBGA
Packaging:
Tray
Series:
Kintex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
20340
NumberofLogicElements/Cells:
355950
TotalRAMBits:
31641600
NumberofI/O:
304
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCKU3P-1FFVD900E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCKU3P-1FFVD900E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCKU3P-1FFVD900E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCKU3P-1FFVD900E information

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XCKU3P-1FFVD900E performance and reliability evaluation in extreme environments

XCKU3P-1FFVD900E is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx, offering versatile functionality and robust performance for a wide range of applications.

Application Scenario:

In critical infrastructure systems, such as aerospace and defense applications, XCKU3P-1FFVD900E can be utilized for its reliability and high-speed processing capabilities. It can perform tasks like real-time data processing, signal processing, and control functions in demanding environments.

Environmental Considerations:

When designing systems with XCKU3P-1FFVD900E, engineers must consider various environmental factors to ensure reliable operation:

- High Temperature: The FPGA must withstand elevated temperatures encountered in environments like engine compartments or desert climates. Thermal management techniques, including heatsinks, fans, or liquid cooling systems, may be employed to maintain optimal operating temperatures.

- Low Temperature: In applications where the temperature can drop significantly, such as space exploration missions or extreme cold environments, the FPGA and associated components should be designed to operate reliably at low temperatures. Cold temperature testing and selection of components rated for low-temperature operation are essential considerations.

- Humidity: High humidity levels can lead to moisture ingress, potentially causing corrosion or electrical shorts in the FPGA and circuitry. Enclosure sealing, conformal coating, and humidity control measures can help mitigate the effects of humidity on system reliability.

Performance Analysis:

In practical applications, XCKU3P-1FFVD900E demonstrates exceptional performance and reliability:

- Signal Processing: The FPGA excels in real-time signal processing tasks, such as radar signal processing in aerospace applications or image processing in medical imaging systems. Its high-speed processing capabilities enable rapid data analysis and decision-making.

- Control Functions: In industrial automation and control systems, XCKU3P-1FFVD900E can effectively control various processes, such as motor control, robotics, and PLC applications. Its reconfigurable nature allows for adaptability to changing control algorithms or system requirements.

- Reliability: Through rigorous testing and validation, XCKU3P-1FFVD900E has demonstrated long-term reliability in harsh environments. It can operate continuously for extended periods without experiencing performance degradation or failure, ensuring uninterrupted operation in mission-critical systems.

Conclusion:

XCKU3P-1FFVD900E offers unparalleled performance and reliability in extreme environmental conditions, making it a preferred choice for applications where robustness and high-speed processing are paramount. By considering environmental factors during the design phase and leveraging the FPGA's capabilities, engineers can develop resilient systems capable of operating in the harshest of environments.

XCKU3P-1FFVD900E FAQ

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6. What is the process for return or replacement of XCKU3P-1FFVD900E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCKU3P-1FFVD900E we delivered, we will accept the replacement or return of the XCKU3P-1FFVD900E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCKU3P-1FFVD900E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations