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Name: XCKU035-1FBVA676C
Brand: AMD Xilinx
SKU: XCKU035-1FBVA676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCKU035-1FBVA676C

Part No.:: XCKU035-1FBVA676C

Manufacturer:: AMD Xilinx

Package:: 676-BBGA, FCBGA

Datasheet:: XCKU035-1FBVA676C.pdf

Description:: IC FPGA 312 I/O 676FCBGA

In Stock:: 3347

Quantity:: Add To Cart

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XCKU035-1FBVA676C Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Kintex® UltraScale™
ProductStatus:
Active
NumberofLABs/CLBs:
25391
NumberofLogicElements/Cells:
444343
TotalRAMBits:
19456000
NumberofI/O:
312
NumberofGates:
-
Voltage-Supply:
0.922V ~ 0.979V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XCKU035-1FBVA676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCKU035-1FBVA676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCKU035-1FBVA676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCKU035-1FBVA676C information

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XCKU035-1FBVA676C performance and reliability evaluation in extreme environments

XCKU035-1FBVA676C is a field-programmable gate array (FPGA) device manufactured by Xilinx, offering high-performance processing capabilities and versatile programmability for a wide range of applications. It features advanced architectural elements, such as programmable logic cells, DSP slices, and configurable I/O blocks, making it suitable for demanding computing tasks.

Environmental Considerations:

In the design of systems incorporating XCKU035-1FBVA676C, environmental factors play a crucial role in ensuring reliable operation. These factors include:

- Temperature: The operating temperature range of XCKU035-1FBVA676C spans from -40°C to 100°C. Thermal management techniques, such as heatsinks or fans, may be necessary to maintain the device within its specified temperature limits, especially in high-temperature environments.

- Humidity: Although XCKU035-1FBVA676C is designed to withstand typical humidity levels encountered in indoor environments, exposure to high humidity or moisture should be minimized to prevent potential damage or malfunction.

- Voltage and Power: Proper voltage regulation and power supply design are essential to ensure stable operation of XCKU035-1FBVA676C. Voltage fluctuations or power surges can adversely affect the device's performance and reliability.

- Altitude: The device's operational parameters may be affected by altitude, particularly at high elevations where atmospheric pressure is lower. Designers should refer to the device datasheet for altitude-related specifications and considerations.

- Vibration and Shock: Mechanical stress from vibration or shock can impact the integrity of solder joints and connections, potentially leading to electrical failures. Adequate mechanical support and shock-absorbing measures should be implemented to mitigate these risks.

Performance Evaluation:

When assessing the performance and reliability of XCKU035-1FBVA676C in extreme environments, thorough testing and analysis are essential. This includes:

- Temperature Testing: Subjecting the device to temperature cycling tests within its specified operating range to evaluate its performance under varying thermal conditions.

- Humidity Testing: Exposing the device to controlled humidity levels, including high humidity environments, to assess its susceptibility to moisture-induced failures.

- Power Supply Variation: Testing the device's response to voltage fluctuations and transient events to ensure robustness against power-related issues.

- Long-Term Reliability: Conducting extended stress tests to simulate prolonged exposure to extreme environmental conditions and verify the device's long-term reliability.

- Failure Analysis: Investigating any observed failures or anomalies to identify root causes and implement corrective measures, such as design modifications or component substitutions.

Conclusion:

XCKU035-1FBVA676C offers high-performance computing capabilities suitable for applications in diverse environments, provided that proper environmental considerations and reliability testing are undertaken during the design and deployment phases. By addressing environmental factors and conducting thorough performance evaluations, designers can ensure the successful operation of systems incorporating XCKU035-1FBVA676C under extreme conditions.

XCKU035-1FBVA676C FAQ

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3. Are the XCKU035-1FBVA676C price and inventory displayed accurate?

The price and inventory of XCKU035-1FBVA676C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XCKU035-1FBVA676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCKU035-1FBVA676C we delivered, we will accept the replacement or return of the XCKU035-1FBVA676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCKU035-1FBVA676C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations