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Name: XCAU20P-2FFVB676E
Brand: AMD Xilinx
SKU: XCAU20P-2FFVB676E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XCAU20P-2FFVB676E

Part No.:: XCAU20P-2FFVB676E

Manufacturer:: AMD Xilinx

Package:: 676-BBGA, FCBGA

Datasheet:: XCAU20P-2FFVB676E.pdf

Description:: IC FPGA ARTIX UP 676FCBGA

In Stock:: 3663

Quantity:: Add To Cart

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XCAU20P-2FFVB676E Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex® UltraScale+™
ProductStatus:
Active
NumberofLABs/CLBs:
13625
NumberofLogicElements/Cells:
238437
TotalRAMBits:
7340032
NumberofI/O:
228
NumberofGates:
-
Voltage-Supply:
0.825V ~ 0.876V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XCAU20P-2FFVB676E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XCAU20P-2FFVB676E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XCAU20P-2FFVB676E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XCAU20P-2FFVB676E information

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XCAU20P-2FFVB676E application case analysis in emerging technology fields

XCAU20P-2FFVB676E is a versatile FPGA (Field-Programmable Gate Array) chip known for its high performance and flexibility, commonly used in a variety of electronic applications. It features a large number of configurable logic blocks and embedded memory, making it suitable for complex digital designs.

Application Scenario:

In the domain of telecommunications, XCAU20P-2FFVB676E plays a crucial role in implementing advanced signal processing algorithms for wireless communication systems.

System Architecture:

To design a wireless communication system utilizing XCAU20P-2FFVB676E, the following architecture can be adopted:

1. Baseband Processing:

Utilize the programmable logic resources of XCAU20P-2FFVB676E to implement baseband processing tasks such as modulation, demodulation, encoding, and decoding of digital signals.

2. Protocol Stack:

Implement the communication protocol stack including physical layer, data link layer, network layer, and transport layer functionalities within the FPGA fabric. This enables efficient communication between wireless devices.

3. Interface Integration:

Integrate various interfaces such as Ethernet, PCIe, USB, or custom interfaces using the configurable I/O resources available in XCAU20P-2FFVB676E. This facilitates connectivity with external devices and networks.

4. Signal Processing Acceleration:

Accelerate computationally intensive signal processing tasks such as channel equalization, error correction, and beamforming using dedicated DSP (Digital Signal Processing) blocks available in XCAU20P-2FFVB676E.

5. Dynamic Reconfiguration:

Utilize the reconfigurable nature of XCAU20P-2FFVB676E to dynamically adapt to changing communication standards or protocols, thereby ensuring future-proof designs.

Considerations:

When designing the wireless communication system with XCAU20P-2FFVB676E, it's essential to consider:

- Resource Optimization: Efficiently utilize the available logic blocks, memory, and I/O resources to meet the performance requirements of the communication system.

- Power Efficiency: Implement power-saving techniques such as clock gating, voltage scaling, and dynamic power management to optimize power consumption in portable or battery-operated devices.

- Signal Integrity: Ensure signal integrity by carefully designing the PCB layout, minimizing signal reflections, and adhering to high-speed design practices to mitigate issues such as signal crosstalk and jitter.

- Security: Implement robust security measures such as encryption, authentication, and secure booting to protect sensitive data and ensure the integrity of the communication system.

- Compliance: Validate the design against relevant industry standards and regulations such as FCC (Federal Communications Commission) regulations for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) compliance.

XCAU20P-2FFVB676E FAQ

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3. Are the XCAU20P-2FFVB676E price and inventory displayed accurate?

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6. What is the process for return or replacement of XCAU20P-2FFVB676E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCAU20P-2FFVB676E we delivered, we will accept the replacement or return of the XCAU20P-2FFVB676E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCAU20P-2FFVB676E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations