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Name: XC7S75-2FGGA484I
Brand: AMD Xilinx
SKU: XC7S75-2FGGA484I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7S75-2FGGA484I

Part No.:: XC7S75-2FGGA484I

Manufacturer:: AMD Xilinx

Package:: 484-BGA

Datasheet:: XC7S75-2FGGA484I.pdf

Description:: IC FPGA 338 I/O 484FBGA

In Stock:: 3577

Quantity:: Add To Cart

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XC7S75-2FGGA484I Specifications

Package/Case:
484-BGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
6000
NumberofLogicElements/Cells:
76800
TotalRAMBits:
4331520
NumberofI/O:
338
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7S75-2FGGA484I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S75-2FGGA484I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S75-2FGGA484I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S75-2FGGA484I information

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XC7S75-2FGGA484I performance and reliability evaluation in extreme environments

XC7S75-2FGGA484I is a field-programmable gate array (FPGA) widely utilized in high-performance computing and embedded system applications. Its versatility, low power consumption, and extensive programmability make it suitable for diverse tasks, ranging from signal processing to real-time control systems.

Environmental Considerations:

When designing systems incorporating XC7S75-2FGGA484I, several environmental factors must be taken into account to ensure optimal performance and reliability.

1. Temperature: XC7S75-2FGGA484I is designed to operate within a specific temperature range. High temperatures can affect its performance and longevity, while low temperatures may lead to functionality issues or even failure. Thermal management techniques, such as heat sinks, fans, or thermal interface materials, are employed to regulate the FPGA's temperature and prevent overheating or cold-related malfunctions.

2. Humidity: Excessive humidity can cause moisture ingress, leading to corrosion and electrical short circuits. Conformal coating or encapsulation techniques are often used to protect XC7S75-2FGGA484I from moisture and ensure long-term reliability, especially in humid environments.

3. Altitude: At high altitudes, the reduced air pressure can affect the FPGA's cooling efficiency and alter its operating characteristics. Proper ventilation and thermal design are crucial to maintain XC7S75-2FGGA484I within its specified temperature range at varying altitudes.

Performance Analysis:

In practical applications, XC7S75-2FGGA484I demonstrates robust performance and reliability under diverse environmental conditions. Its extensive programmability allows for customization to meet specific application requirements, while its low power consumption minimizes thermal issues in constrained environments.

Real-time Control Systems: XC7S75-2FGGA484I is often employed in real-time control systems, such as industrial automation and aerospace applications, where reliability and responsiveness are paramount. Its fast processing capabilities and configurable logic elements enable precise control and rapid response to dynamic environmental changes.

Signal Processing: In signal processing tasks, XC7S75-2FGGA484I excels in handling complex algorithms and data streams with high throughput and low latency. Its parallel processing architecture and efficient routing resources facilitate real-time processing of sensor data and communication interfaces.

High-Performance Computing: XC7S75-2FGGA484I is also utilized in high-performance computing clusters and data centers for tasks like encryption, data compression, and machine learning inference. Its scalability and reconfigurability enable seamless integration into heterogeneous computing environments, enhancing overall system performance and efficiency.

Conclusion:

XC7S75-2FGGA484I exhibits commendable performance and reliability in extreme environmental conditions, owing to its robust design and versatile capabilities. By considering environmental factors during the design phase and implementing appropriate mitigation measures, engineers can harness the full potential of XC7S75-2FGGA484I across various applications with confidence.

XC7S75-2FGGA484I FAQ

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3. Are the XC7S75-2FGGA484I price and inventory displayed accurate?

The price and inventory of XC7S75-2FGGA484I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC7S75-2FGGA484I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S75-2FGGA484I we delivered, we will accept the replacement or return of the XC7S75-2FGGA484I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S75-2FGGA484I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations