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Name: XC7S75-1FGGA676I
Brand: AMD Xilinx
SKU: XC7S75-1FGGA676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7S75-1FGGA676I

Part No.:: XC7S75-1FGGA676I

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XC7S75-1FGGA676I.pdf

Description:: IC FPGA 400 I/O 676FPBGA

In Stock:: 3054

Quantity:: Add To Cart

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XC7S75-1FGGA676I Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
6000
NumberofLogicElements/Cells:
76800
TotalRAMBits:
4331520
NumberofI/O:
400
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7S75-1FGGA676I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S75-1FGGA676I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S75-1FGGA676I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S75-1FGGA676I information

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XC7S75-1FGGA676I performance and reliability evaluation in extreme environments

XC7S75-1FGGA676I is a field-programmable gate array (FPGA) manufactured by Xilinx, designed to deliver high performance and flexibility for a wide range of applications. This article explores its performance and reliability evaluation in extreme environmental conditions, considering factors such as high temperature, low temperature, humidity, and more.

Environmental Considerations:

In the design of systems incorporating XC7S75-1FGGA676I, several environmental factors must be taken into account:

- High Temperature: The FPGA's operation at high temperatures should be carefully assessed to ensure reliable performance without degradation or failure. Proper heat sinking and thermal management techniques are essential to mitigate thermal stress.

- Low Temperature: Extreme cold environments can impact the FPGA's functionality, affecting its speed and power consumption. Cold temperature testing is necessary to validate its operation under such conditions.

- Humidity: Moisture levels in the environment can lead to corrosion and electrical malfunctions. Conformal coating or sealing techniques may be employed to protect the XC7S75-1FGGA676I from moisture ingress.

- Vibration and Shock: Mechanical stresses from vibration and shock can cause physical damage to the FPGA and its connections. Adequate mounting and shock-absorbing measures should be implemented in the system design.

- Radiation: In radiation-prone environments, such as space or nuclear applications, the FPGA's susceptibility to ionizing radiation should be evaluated. Radiation-hardened versions or shielding may be required for mission-critical systems.

Performance Analysis:

In practical applications, XC7S75-1FGGA676I has demonstrated robust performance and reliability, even in demanding environments. Its features, including high-speed interfaces, ample logic resources, and advanced DSP capabilities, make it suitable for a variety of tasks.

- Signal Processing: The FPGA's DSP slices enable efficient implementation of signal processing algorithms, making it ideal for applications such as digital communications, radar, and image processing.

- Embedded Systems: With its reconfigurable nature, XC7S75-1FGGA676I is widely used in embedded systems for tasks such as motor control, sensor interfacing, and real-time control applications.

- High-Performance Computing: In compute-intensive tasks, the FPGA's parallel processing capability provides significant performance advantages over traditional processors, making it suitable for tasks like encryption, data compression, and machine learning inference.

- System Integration: The FPGA's flexibility allows for seamless integration with other system components, such as microcontrollers, sensors, and communication interfaces, enabling the development of complex, multifunctional systems.

Conclusion:

XC7S75-1FGGA676I offers exceptional performance and reliability in extreme environmental conditions, with careful consideration of factors such as temperature, humidity, and mechanical stress. Its versatility makes it a preferred choice for a wide range of applications, from aerospace and defense to industrial automation and telecommunications.

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6. What is the process for return or replacement of XC7S75-1FGGA676I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S75-1FGGA676I we delivered, we will accept the replacement or return of the XC7S75-1FGGA676I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S75-1FGGA676I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations