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Name: XC7S50-2CSGA324I
Brand: Xilinx Inc.
SKU: XC7S50-2CSGA324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC7S50-2CSGA324I

Part No.:: XC7S50-2CSGA324I

Manufacturer:: Xilinx Inc.

Package:: 324-LFBGA, CSPBGA

Datasheet:: XC7S50-2CSGA324I.pdf

Description:: IC FPGA 210 I/O 324CSBGA

In Stock:: 3387

Quantity:: Add To Cart

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XC7S50-2CSGA324I Specifications

Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
4075
NumberofLogicElements/Cells:
52160
TotalRAMBits:
2764800
NumberofI/O:
210
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7S50-2CSGA324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S50-2CSGA324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S50-2CSGA324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S50-2CSGA324I information

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XC7S50-2CSGA324I Typical application Circuitry

XC7S50-2CSGA324I

The XC7S50-2CSGA324I is an FPGA (Field-Programmable Gate Array) chip from Xilinx's Spartan-7 series. FPGAs like this are designed to be configurable post-manufacture, enabling a wide array of digital circuit implementations.

Application Scenarios:

With its adaptable nature, the XC7S50-2CSGA324I finds utility in diverse settings:

- Embedded systems for IoT devices

- Automotive control units

- Low-power wireless communication modules

- Industrial automation systems

- Portable medical devices

Key Features:

- Logic cells: Approximately 52,160

- Embedded memory: Adequate

- Digital signal processing slices: Present

- Maximum I/O pins: 250

- Package: CSGA324 (324-pin Chip Scale BGA)

Application Example: Low-Power Wireless Communication Module:

1. Initial Setup: Begin by mounting the XC7S50-2CSGA324I FPGA onto your designated PCB. Ensure all critical pins are easily accessible.

2. Power Supply Connections: Connect the VCC pins of the XC7S50-2CSGA324I to a suitable power source (typically 3.3V). Additionally, link all GND pins to the circuit's ground.

3. I/O Configuration: Assign specific pins on the XC7S50-2CSGA324I for data input and output, depending on the communication protocol being implemented.

4. JTAG Interface:

- TDI (Test Data In): Connect this to pin 1 to facilitate data input to the JTAG tool.

- TDO (Test Data Out): Link this to pin 2 for data output from the JTAG tool.

- TCK (Test Clock): Associate this with pin 3 to synchronize with the JTAG tool's clock.

- TMS (Test Mode Select): Bind this to pin 4 for mode selection within the JTAG tool.

5. Wireless Module Logic Design: Utilize software like Vivado to program the XC7S50-2CSGA324I with the necessary logic for the wireless communication module. This includes encoding, decoding, and error correction functionalities.

6. Clock Synchronization: Ensure that the XC7S50-2CSGA324I is connected to an external clock source, aligning with the communication module's timing requirements.

7. Integration with Wireless Components: Interface the XC7S50-2CSGA324I with essential components such as RF transceivers, antennas, and power amplifiers, using designated FPGA pins.

Design Considerations:

1. Stable Power Supply: It's crucial to maintain a consistent power supply to the XC7S50-2CSGA324I for optimal performance.

2. Thermal Management: Given that FPGAs can heat up during operation, consider implementing cooling solutions like heat sinks or fans.

3. Signal Integrity: A solid grounding strategy, coupled with the strategic placement of decoupling capacitors, can enhance signal quality.

4. Upgradability: Design the circuit with future enhancements in mind, allowing for easy updates to the XC7S50-2CSGA324I's firmware.

5. Layout Efficiency: Given the XC7S50-2CSGA324I's packaging, meticulous planning is required to optimize space and ensure effective trace routing.

The XC7S50-2CSGA324I, as part of Xilinx's Spartan-7 lineup, exemplifies the versatility of modern FPGAs. Its application in a low-power wireless communication module is just one illustration of its potential. With careful design considerations, this FPGA can be harnessed to drive innovative digital solutions.

XC7S50-2CSGA324I FAQ

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3. Are the XC7S50-2CSGA324I price and inventory displayed accurate?

The price and inventory of XC7S50-2CSGA324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC7S50-2CSGA324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S50-2CSGA324I we delivered, we will accept the replacement or return of the XC7S50-2CSGA324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S50-2CSGA324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations