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Name: XC7S25-L1CSGA225I
Brand: AMD Xilinx
SKU: XC7S25-L1CSGA225I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7S25-L1CSGA225I

Part No.:: XC7S25-L1CSGA225I

Manufacturer:: AMD Xilinx

Package:: 225-LFBGA, CSPBGA

Datasheet:: XC7S25-L1CSGA225I.pdf

Description:: IC FPGA 150 I/O 225CSGA

In Stock:: 2005

Quantity:: Add To Cart

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XC7S25-L1CSGA225I Specifications

Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
1825
NumberofLogicElements/Cells:
23360
TotalRAMBits:
1658880
NumberofI/O:
150
NumberofGates:
-
Voltage-Supply:
0.92V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7S25-L1CSGA225I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S25-L1CSGA225I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S25-L1CSGA225I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S25-L1CSGA225I information

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XC7S25-L1CSGA225I performance and reliability evaluation in extreme environments

XC7S25-L1CSGA225I is an ultimate field-programmable gate array (FPGA) device, known for its high performance and versatility in a wide range of applications. When considering its performance and reliability in extreme environments, such as high temperature, low temperature, and humidity, several factors need to be taken into account in the design process.

Environmental Considerations:

XC7S25-L1CSGA225I is designed to withstand a broad spectrum of environmental conditions. However, to ensure optimal performance and reliability, the following considerations should be made:

1. Temperature: The FPGA should be capable of operating within specified temperature ranges. Adequate cooling mechanisms, such as heat sinks or fans, may be necessary to maintain temperatures within acceptable limits, especially in high-temperature environments.

2. Humidity: Moisture can affect the performance of electronic components, including FPGAs. Proper sealing and conformal coating techniques should be employed to protect the device from humidity-related issues, such as corrosion or short circuits.

3. Shock and Vibration: In harsh environments where shock and vibration are prevalent, mechanical robustness becomes crucial. The FPGA board should be designed to withstand mechanical stresses and vibrations to prevent solder joint failures or component damage.

4. Radiation: Radiation can degrade the performance of electronic components over time. For applications in radiation-prone environments, such as aerospace or nuclear industries, radiation-hardened FPGAs may be required to ensure long-term reliability.

5. Power Supply Stability: Fluctuations in power supply can impact the operation of FPGAs. Proper power conditioning and voltage regulation techniques should be implemented to ensure stable and clean power delivery to the device.

Performance Analysis:

In practical applications, XC7S25-L1CSGA225I has demonstrated exceptional performance and reliability, even in extreme environmental conditions. For example, in aerospace applications where temperature variations are significant, this FPGA has consistently delivered reliable operation without compromising performance.

Moreover, in industrial settings exposed to high levels of humidity and vibration, XC7S25-L1CSGA225I has proven to be robust and resilient, maintaining stable functionality over extended periods.

Conclusion:

In conclusion, XC7S25-L1CSGA225I stands out as the ultimate choice for FPGA applications requiring high performance and reliability in extreme environmental conditions. By carefully considering environmental factors during the design phase and leveraging the inherent robustness of this FPGA, engineers can ensure the successful deployment of their systems in the harshest of environments.

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6. What is the process for return or replacement of XC7S25-L1CSGA225I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S25-L1CSGA225I we delivered, we will accept the replacement or return of the XC7S25-L1CSGA225I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S25-L1CSGA225I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations