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Name: XC7S15-2CSGA225I
Brand: AMD Xilinx
SKU: XC7S15-2CSGA225I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7S15-2CSGA225I

Part No.:: XC7S15-2CSGA225I

Manufacturer:: AMD Xilinx

Package:: 225-LFBGA, CSPBGA

Datasheet:: XC7S15-2CSGA225I.pdf

Description:: IC FPGA 100 I/O 225CSBGA

In Stock:: 3567

Quantity:: Add To Cart

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XC7S15-2CSGA225I Specifications

Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
1000
NumberofLogicElements/Cells:
12800
TotalRAMBits:
368640
NumberofI/O:
100
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7S15-2CSGA225I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S15-2CSGA225I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S15-2CSGA225I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S15-2CSGA225I information

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XC7S15-2CSGA225I performance and reliability evaluation in extreme environments

XC7S15-2CSGA225I is a field-programmable gate array (FPGA) chip manufactured by Xilinx, designed to provide high-performance processing capabilities for a wide range of applications. Its compact size, low power consumption, and versatile features make it suitable for use in various environments, including extreme conditions.

Environmental Considerations:

In the design of systems incorporating XC7S15-2CSGA225I, several environmental factors must be taken into account to ensure reliable operation:

- Temperature: The FPGA chip must be able to withstand a wide temperature range, from extreme heat to freezing cold. Proper thermal management techniques, such as heat sinks or fans, may be employed to maintain optimal operating temperatures.

- Humidity: High humidity levels can affect the performance of electronic components, leading to corrosion and short circuits. Enclosures with moisture-resistant seals or conformal coating on PCBs can mitigate the impact of humidity.

- Shock and Vibration: In rugged environments or applications subject to frequent movement, the FPGA chip must be able to withstand shocks and vibrations. Secure mounting and mechanical reinforcement can prevent damage or disconnection of the chip.

- EMC/EMI: Electromagnetic compatibility and interference can disrupt the operation of electronic systems. Proper shielding and filtering techniques should be implemented to minimize the effects of electromagnetic radiation.

Performance Analysis:

Despite challenging environmental conditions, XC7S15-2CSGA225I demonstrates robust performance and reliability in practical applications. For example:

- In aerospace and defense systems, where temperature variations and mechanical stresses are common, XC7S15-2CSGA225I has been utilized in mission-critical functions such as signal processing and communication protocols with proven stability and accuracy.

- In industrial automation, where harsh operating conditions including temperature extremes and vibration are prevalent, XC7S15-2CSGA225I has shown resilience in controlling complex processes and interfacing with various sensors and actuators.

- In automotive electronics, where reliability under high temperatures and resistance to moisture are essential, XC7S15-2CSGA225I has been integrated into advanced driver assistance systems (ADAS) and infotainment systems, delivering consistent performance and safety features.

Conclusion:

XC7S15-2CSGA225I exemplifies Xilinx's commitment to delivering FPGA solutions that excel in demanding environments. By addressing environmental challenges through careful design considerations and leveraging the chip's inherent capabilities, engineers can deploy robust and reliable systems for a variety of applications.

XC7S15-2CSGA225I FAQ

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6. What is the process for return or replacement of XC7S15-2CSGA225I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S15-2CSGA225I we delivered, we will accept the replacement or return of the XC7S15-2CSGA225I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S15-2CSGA225I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations