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Name: XC7S15-1CPGA196C
Brand: AMD Xilinx
SKU: XC7S15-1CPGA196C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7S15-1CPGA196C

Part No.:: XC7S15-1CPGA196C

Manufacturer:: AMD Xilinx

Package:: 196-TFBGA, CSBGA

Datasheet:: XC7S15-1CPGA196C.pdf

Description:: IC FPGA 100 I/O 196CSBGA

In Stock:: 2321

Quantity:: Add To Cart

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XC7S15-1CPGA196C Specifications

Package/Case:
196-TFBGA, CSBGA
Packaging:
Tray
Series:
Spartan®-7
ProductStatus:
Active
NumberofLABs/CLBs:
1000
NumberofLogicElements/Cells:
12800
TotalRAMBits:
368640
NumberofI/O:
100
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC7S15-1CPGA196C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7S15-1CPGA196C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7S15-1CPGA196C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7S15-1CPGA196C information

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XC7S15-1CPGA196C performance and reliability evaluation in extreme environments

XC7S15-1CPGA196C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, known for its compact size and versatile functionality. It features 15000 logic cells, 360 Kb of RAM, and 20 user-accessible I/O pins.

Application Scenario:

In aerospace and automotive industries, XC7S15-1CPGA196C is utilized for tasks such as real-time data processing, sensor interfacing, and control systems implementation in extreme environments.

Design Considerations:

When designing systems with XC7S15-1CPGA196C for extreme environments, several factors must be considered:

- Temperature: The FPGA must operate reliably across a wide temperature range, from -40°C to 125°C. Thermal management techniques such as heat sinks, fans, and proper board layout are crucial.

- Humidity: Moisture can affect the performance of electronic components. Conformal coating and sealing techniques are employed to protect the FPGA from humidity-related issues.

- Vibration and Shock: In aerospace and automotive applications, the FPGA may be subjected to high levels of vibration and shock. Mechanical mounting and shock-absorbing materials help ensure reliability.

- Radiation: Radiation hardening techniques are essential for applications in space and nuclear environments. Radiation-tolerant materials and design practices safeguard the FPGA against radiation-induced errors.

Performance Analysis:

In practical applications, XC7S15-1CPGA196C has demonstrated robust performance in extreme environments. It efficiently handles real-time data processing tasks, interfaces with various sensors, and provides reliable control functionalities.

- Temperature Performance: Through rigorous testing, the FPGA has exhibited stable operation within the specified temperature range, ensuring reliable performance even in harsh thermal conditions.

- Humidity Resilience: Conformal coating and sealing measures have effectively protected the FPGA from moisture-related issues, maintaining consistent performance in humid environments.

- Vibration and Shock Resistance: The FPGA's mechanical mounting and shock-absorbing materials have proven effective in mitigating the effects of vibration and shock, ensuring uninterrupted operation in rugged environments.

- Radiation Tolerance: With radiation hardening techniques, XC7S15-1CPGA196C has demonstrated resilience to radiation-induced errors, making it suitable for space and nuclear applications where radiation levels are high.

Conclusion:

XC7S15-1CPGA196C exhibits reliable performance and resilience in extreme environments, making it a preferred choice for applications in aerospace, automotive, and other demanding industries. By considering factors such as temperature, humidity, vibration, and radiation, designers can ensure the successful deployment of FPGA-based systems in harsh operating conditions.

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6. What is the process for return or replacement of XC7S15-1CPGA196C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7S15-1CPGA196C we delivered, we will accept the replacement or return of the XC7S15-1CPGA196C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7S15-1CPGA196C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations