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Name: XC7A200T-L2FBG676E
Brand: AMD Xilinx
SKU: XC7A200T-L2FBG676E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A200T-L2FBG676E

Part No.:: XC7A200T-L2FBG676E

Manufacturer:: AMD Xilinx

Package:: 676-BBGA, FCBGA

Datasheet:: XC7A200T-L2FBG676E.pdf

Description:: IC FPGA 400 I/O 676FCBGA

In Stock:: 3154

Quantity:: Add To Cart

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XC7A200T-L2FBG676E Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
16825
NumberofLogicElements/Cells:
215360
TotalRAMBits:
13455360
NumberofI/O:
400
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XC7A200T-L2FBG676E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A200T-L2FBG676E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A200T-L2FBG676E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A200T-L2FBG676E information

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XC7A200T-L2FBG676E application case analysis in emerging technology fields

XC7A200T-L2FBG676E is a powerful FPGA chip manufactured by Xilinx, offering high performance and flexibility for a wide range of applications. It features a large number of programmable logic cells, embedded DSP slices, high-speed transceivers, and versatile I/O capabilities.

Application Scenario:

In the field of digital signal processing (DSP), XC7A200T-L2FBG676E can be utilized to implement complex algorithms for real-time audio and video processing, wireless communication systems, and radar signal processing.

System Design:

To design a high-performance DSP system using XC7A200T-L2FBG676E, consider the following key components:

1. Algorithm Implementation:

Develop and optimize DSP algorithms using Xilinx Vivado design suite to leverage the parallel processing capabilities of XC7A200T-L2FBG676E for efficient computation of complex signal processing tasks.

2. Interface Integration:

Integrate various interfaces such as DDR memory controllers, high-speed serial transceivers, and Ethernet MACs to facilitate data exchange with external devices and networks. Utilize the flexible I/O capabilities of XC7A200T-L2FBG676E to interface with different peripherals and sensors.

3. Power Optimization:

Implement power-saving techniques such as clock gating, voltage scaling, and dynamic power management to optimize power consumption without compromising performance in battery-operated or energy-efficient applications.

4. Real-Time Processing:

Utilize the high-speed DSP slices and parallel processing capabilities of XC7A200T-L2FBG676E to achieve real-time processing of streaming data with low latency, critical for applications such as audio/video processing and wireless communication systems.

5. Security:

Implement security features such as cryptographic accelerators and secure boot capabilities to protect sensitive data and intellectual property from unauthorized access and tampering, ensuring the integrity and confidentiality of the system.

Considerations:

When designing DSP systems with XC7A200T-L2FBG676E, it's essential to consider:

- Resource Utilization: Efficiently utilize the programmable logic and DSP resources of XC7A200T-L2FBG676E to maximize performance and minimize resource wastage.

- Timing Closure: Ensure that the design meets timing constraints to achieve reliable operation at the desired clock frequency, avoiding timing violations and performance degradation.

- Thermal Management: Implement effective thermal management strategies such as heat sinks and thermal vias to dissipate heat generated during operation and prevent overheating, ensuring long-term reliability and performance stability.

- System Verification: Thoroughly test and verify the functionality, performance, and reliability of the DSP system using simulation, emulation, and hardware-in-the-loop (HIL) testing to ensure compliance with specifications and requirements.

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6. What is the process for return or replacement of XC7A200T-L2FBG676E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A200T-L2FBG676E we delivered, we will accept the replacement or return of the XC7A200T-L2FBG676E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A200T-L2FBG676E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations