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Name: XC7A200T-3FBG676E
Brand: AMD Xilinx
SKU: XC7A200T-3FBG676E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A200T-3FBG676E

Part No.:: XC7A200T-3FBG676E

Manufacturer:: AMD Xilinx

Package:: 676-BBGA, FCBGA

Datasheet:: XC7A200T-3FBG676E.pdf

Description:: IC FPGA 400 I/O 676FCBGA

In Stock:: 2497

Quantity:: Add To Cart

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XC7A200T-3FBG676E Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
16825
NumberofLogicElements/Cells:
215360
TotalRAMBits:
13455360
NumberofI/O:
400
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XC7A200T-3FBG676E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A200T-3FBG676E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A200T-3FBG676E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A200T-3FBG676E information

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XC7A200T-3FBG676E performance and reliability evaluation in extreme environments

XC7A200T-3FBG676E is a high-performance FPGA (Field Programmable Gate Array) manufactured by Xilinx, designed to operate in extreme environmental conditions while maintaining reliability and functionality. Its robust features make it suitable for applications requiring resilience to factors such as high temperatures, low temperatures, and humidity.

Environmental Considerations:

When designing with XC7A200T-3FBG676E, engineers must account for various environmental factors to ensure optimal performance and longevity:

- High Temperature: The FPGA's design incorporates heat-resistant materials and efficient thermal management techniques to withstand elevated temperatures without compromising functionality. Additionally, the use of heat sinks or fans may be employed in extreme temperature environments to dissipate excess heat and maintain operational stability.

- Low Temperature: To address low temperature conditions, the FPGA's design includes components rated for extended temperature ranges and ensures proper functionality even in sub-zero environments. Cold-start circuitry may also be implemented to facilitate reliable operation during startup in freezing temperatures.

- Humidity: XC7A200T-3FBG676E is engineered with moisture-resistant materials and conformal coatings to mitigate the effects of humidity and prevent moisture ingress, thereby safeguarding against corrosion and electrical shorts. Additionally, environmental sealing techniques may be employed to protect the FPGA from moisture exposure in humid environments.

Performance Analysis:

Despite the challenges posed by extreme environmental conditions, XC7A200T-3FBG676E demonstrates exceptional performance and reliability in practical applications:

- Aerospace: In aerospace applications, where temperature variations and humidity fluctuations are common, XC7A200T-3FBG676E serves as a vital component in avionics systems, offering reliable processing power for mission-critical tasks such as navigation, communication, and data processing.

- Industrial Automation: In industrial settings subject to harsh environmental conditions, such as foundries or chemical plants, XC7A200T-3FBG676E facilitates robust control and monitoring functionalities, ensuring uninterrupted operation of machinery and processes despite temperature extremes and humidity fluctuations.

- Automotive: Within automotive systems, where temperature variations between extreme cold and heat are prevalent, XC7A200T-3FBG676E enables advanced driver assistance systems (ADAS), infotainment, and vehicle networking capabilities, demonstrating resilience to environmental stressors while delivering high performance and reliability.

Conclusion:

XC7A200T-3FBG676E exemplifies Xilinx's commitment to engineering FPGA solutions that excel in demanding environments. By integrating robust design features and employing advanced materials and techniques, this FPGA delivers consistent performance and reliability across a wide range of applications, ensuring optimal functionality even in the face of extreme environmental conditions.

XC7A200T-3FBG676E FAQ

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3. Are the XC7A200T-3FBG676E price and inventory displayed accurate?

The price and inventory of XC7A200T-3FBG676E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC7A200T-3FBG676E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A200T-3FBG676E we delivered, we will accept the replacement or return of the XC7A200T-3FBG676E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A200T-3FBG676E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations