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Name: XC7A200T-1FFG1156I
Brand: AMD Xilinx
SKU: XC7A200T-1FFG1156I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A200T-1FFG1156I

Part No.:: XC7A200T-1FFG1156I

Manufacturer:: AMD Xilinx

Package:: 1156-BBGA, FCBGA

Datasheet:: XC7A200T-1FFG1156I.pdf

Description:: IC FPGA 500 I/O 1156FCBGA

In Stock:: 3465

Quantity:: Add To Cart

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XC7A200T-1FFG1156I Specifications

Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
16825
NumberofLogicElements/Cells:
215360
TotalRAMBits:
13455360
NumberofI/O:
500
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC7A200T-1FFG1156I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A200T-1FFG1156I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A200T-1FFG1156I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A200T-1FFG1156I information

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XC7A200T-1FFG1156I performance and reliability evaluation in extreme environments

XC7A200T-1FFG1156I is a high-performance FPGA (Field-Programmable Gate Array) manufactured by Xilinx, designed to deliver exceptional processing power and flexibility for a wide range of applications, including aerospace, automotive, telecommunications, and industrial automation.

Environmental Considerations:

In extreme operating environments, such as high temperatures, low temperatures, and high humidity, the XC7A200T-1FFG1156I must meet stringent reliability and performance standards. During the design phase, several factors are considered to ensure its robustness:

1. Temperature Management: The FPGA's thermal characteristics are carefully analyzed to implement effective heat dissipation mechanisms, including heatsinks, thermal pads, and fans, to maintain optimal operating temperatures.

2. Environmental Sealing: To withstand harsh conditions, the device may be encapsulated in protective coatings or housed within sealed enclosures to prevent moisture ingress and corrosion.

3. Material Selection: Components and materials used in the construction of the FPGA and its surrounding circuitry are chosen for their resistance to temperature extremes and environmental degradation.

4. Reliability Testing: Before deployment, the XC7A200T-1FFG1156I undergoes rigorous testing under simulated extreme environmental conditions to validate its performance and reliability over time.

Performance Analysis:

In real-world applications, the XC7A200T-1FFG1156I excels in demanding environments, demonstrating exceptional performance and reliability:

1. Aerospace: In aerospace systems, where temperature variations are extreme, the FPGA reliably handles complex data processing tasks, such as flight control and navigation, without compromising performance.

2. Automotive: Automotive electronics benefit from the XC7A200T-1FFG1156I's robustness, withstanding high temperatures in engine compartments and ensuring continuous operation of critical systems like engine management and driver assistance.

3. Telecommunications: Telecom infrastructure relies on the FPGA's processing power to maintain network stability and handle high data traffic, even in environments with fluctuating temperatures and humidity levels.

4. Industrial Automation: In industrial settings, the FPGA's versatility enables precise control of manufacturing processes, facilitating automation and monitoring tasks in environments with varying temperature and humidity conditions.

Conclusion:

The XC7A200T-1FFG1156I FPGA demonstrates remarkable performance and reliability in extreme environments, thanks to meticulous design considerations and thorough testing. Its ability to operate flawlessly under challenging conditions makes it a preferred choice for mission-critical applications across diverse industries.

XC7A200T-1FFG1156I FAQ

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6. What is the process for return or replacement of XC7A200T-1FFG1156I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A200T-1FFG1156I we delivered, we will accept the replacement or return of the XC7A200T-1FFG1156I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A200T-1FFG1156I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations