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Name: XC7A200T-1FBG676C
Brand: AMD Xilinx
SKU: XC7A200T-1FBG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A200T-1FBG676C

Part No.:: XC7A200T-1FBG676C

Manufacturer:: AMD Xilinx

Package:: 676-BBGA, FCBGA

Datasheet:: XC7A200T-1FBG676C.pdf

Description:: IC FPGA 400 I/O 676FCBGA

In Stock:: 3751

Quantity:: Add To Cart

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XC7A200T-1FBG676C Specifications

Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
16825
NumberofLogicElements/Cells:
215360
TotalRAMBits:
13455360
NumberofI/O:
400
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC7A200T-1FBG676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A200T-1FBG676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A200T-1FBG676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A200T-1FBG676C information

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XC7A200T-1FBG676C performance and reliability evaluation in extreme environments

XC7A200T-1FBG676C is a high-performance field-programmable gate array (FPGA) designed by Xilinx, offering a versatile platform for a wide range of applications, including aerospace, automotive, telecommunications, and industrial automation. Its advanced features and robust architecture make it suitable for deployment in extreme environmental conditions.

Environmental Considerations:

When designing systems with XC7A200T-1FBG676C for extreme environments, several environmental factors need to be considered to ensure reliable operation:

- Temperature: The FPGA's operating temperature range should be compatible with the intended environmental conditions. Thermal management techniques, such as heatsinks or fans, may be employed to mitigate temperature extremes.

- Humidity: Moisture can affect the performance and reliability of electronic components. Proper sealing and conformal coating may be applied to protect the FPGA from humidity-related issues.

- Vibration and Shock: In environments subject to vibration or shock, the PCB layout and mounting mechanisms should be designed to withstand mechanical stress and ensure the integrity of the XC7A200T-1FBG676C connections.

- EMC/EMI: Electromagnetic compatibility and electromagnetic interference must be addressed to prevent signal degradation or corruption. Shielding techniques and careful PCB layout can help minimize EMC/EMI issues.

- Radiation: For aerospace or high-altitude applications, radiation hardening may be necessary to protect the FPGA from ionizing radiation effects, such as single-event upsets (SEUs) or latch-up.

Performance Analysis:

In practical applications, XC7A200T-1FBG676C has demonstrated excellent performance and reliability in extreme environments:

- Aerospace: In satellite systems, the FPGA has been utilized for onboard data processing and communication, showcasing its resilience to space radiation and vacuum conditions.

- Automotive: In automotive electronics, the FPGA has been deployed in engine control units (ECUs) and advanced driver-assistance systems (ADAS) to handle real-time processing tasks, demonstrating its reliability in temperature-varying and vibration-prone environments.

- Telecommunications: In telecommunications infrastructure, the FPGA has been employed in base station equipment and optical networking devices, showcasing its ability to operate in harsh outdoor environments with temperature fluctuations and moisture exposure.

- Industrial Automation: In industrial control systems, the FPGA has been used for high-speed data acquisition and processing in manufacturing plants and energy facilities, proving its reliability under demanding temperature, humidity, and vibration conditions.

Conclusion:

XC7A200T-1FBG676C is a versatile FPGA with robust performance and reliability, making it well-suited for deployment in extreme environmental conditions across various industries. By carefully considering environmental factors during design and validation, engineers can ensure the successful integration of the FPGA into systems operating in challenging environments.

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6. What is the process for return or replacement of XC7A200T-1FBG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A200T-1FBG676C we delivered, we will accept the replacement or return of the XC7A200T-1FBG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A200T-1FBG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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