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Name: XC7A15T-3FTG256E
Brand: AMD Xilinx
SKU: XC7A15T-3FTG256E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A15T-3FTG256E

Part No.:: XC7A15T-3FTG256E

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XC7A15T-3FTG256E.pdf

Description:: IC FPGA 170 I/O 256FTBGA

In Stock:: 2866

Quantity:: Add To Cart

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XC7A15T-3FTG256E Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
1300
NumberofLogicElements/Cells:
16640
TotalRAMBits:
921600
NumberofI/O:
170
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

XC7A15T-3FTG256E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A15T-3FTG256E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A15T-3FTG256E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A15T-3FTG256E information

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XC7A15T-3FTG256E performance and reliability evaluation in extreme environments

XC7A15T-3FTG256E is a field-programmable gate array (FPGA) manufactured by Xilinx, offering high-performance processing capabilities and programmable logic resources. It is designed to operate in extreme environmental conditions while maintaining reliability and performance.

Environmental Considerations:

In the design of XC7A15T-3FTG256E based systems, various environmental factors such as temperature, humidity, and altitude must be taken into account to ensure reliable operation. The FPGA is specified to operate within a wide temperature range, typically from -40°C to 100°C, allowing it to function in both harsh industrial environments and extreme outdoor conditions.

Thermal Management:

To mitigate the effects of high temperatures, thermal management techniques such as heatsinks, fans, and thermal vias can be employed to dissipate heat effectively from the XC7A15T-3FTG256E device and surrounding components. Proper airflow and heat sinking ensure that the FPGA remains within its specified operating temperature range to prevent thermal-induced performance degradation or failure.

Humidity and Moisture Protection:

For applications exposed to high humidity or moisture, conformal coating and sealing techniques can be applied to protect the XC7A15T-3FTG256E FPGA and circuit board from moisture ingress. This helps prevent corrosion, dendritic growth, and electrical short circuits, ensuring long-term reliability in humid environments.

Altitude Compensation:

In high-altitude applications, where reduced air pressure can affect device performance, the design should consider altitude compensation techniques to ensure proper operation of the XC7A15T-3FTG256E FPGA. This may involve adjusting clock frequencies, voltage levels, or employing specialized compensation algorithms to maintain reliable functionality at different altitudes.

Performance Analysis:

In practical applications, XC7A15T-3FTG256E demonstrates robust performance and reliability even in extreme environmental conditions. Its programmable logic resources and advanced features enable it to adapt to varying system requirements and perform complex tasks with high efficiency.

Real-world Applications:

- Aerospace and Defense: XC7A15T-3FTG256E FPGAs are utilized in avionics systems, satellite communications, and military-grade equipment, where reliability and performance under extreme temperatures and altitude are critical.

- Automotive: In automotive applications, XC7A15T-3FTG256E FPGAs are employed in advanced driver assistance systems (ADAS), engine control units (ECUs), and infotainment systems, providing high-speed processing and adaptability to harsh environmental conditions.

- Industrial Automation: XC7A15T-3FTG256E FPGAs are used in industrial control systems, robotics, and process automation, offering real-time processing and flexibility to operate in rugged environments with temperature variations and humidity.

Conclusion:

XC7A15T-3FTG256E FPGA excels in extreme environmental conditions, thanks to its robust design, thermal management features, and adaptability to varying operating conditions. By considering environmental factors during the design phase and implementing appropriate mitigation strategies, designers can ensure the reliability and performance of XC7A15T-3FTG256E based systems in challenging environments.

XC7A15T-3FTG256E FAQ

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6. What is the process for return or replacement of XC7A15T-3FTG256E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A15T-3FTG256E we delivered, we will accept the replacement or return of the XC7A15T-3FTG256E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A15T-3FTG256E.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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