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Name: XC7A100T-2FGG676C
Brand: AMD Xilinx
SKU: XC7A100T-2FGG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A100T-2FGG676C

Part No.:: XC7A100T-2FGG676C

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XC7A100T-2FGG676C.pdf

Description:: IC FPGA 300 I/O 676FBGA

In Stock:: 3587

Quantity:: Add To Cart

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XC7A100T-2FGG676C Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
7925
NumberofLogicElements/Cells:
101440
TotalRAMBits:
4976640
NumberofI/O:
300
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC7A100T-2FGG676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A100T-2FGG676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A100T-2FGG676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A100T-2FGG676C information

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XC7A100T-2FGG676C performance and reliability evaluation in extreme environments

XC7A100T-2FGG676C is a field-programmable gate array (FPGA) manufactured by Xilinx, known for its high performance and versatility in various embedded system applications. In extreme environmental conditions, such as high temperatures, low temperatures, and humidity, the performance and reliability of XC7A100T-2FGG676C play a crucial role in ensuring the proper functioning of electronic systems.

Design Considerations:

When designing electronic systems using XC7A100T-2FGG676C, several environmental factors need to be considered to ensure optimal performance and reliability:

1. Thermal Management: High temperatures can adversely affect the operation of XC7A100T-2FGG676C and surrounding components. Adequate thermal management techniques, such as heatsinks, fans, or thermal vias on the PCB, should be implemented to dissipate heat effectively and maintain the FPGA within its specified operating temperature range.

2. Low Temperature Operation: XC7A100T-2FGG676C should also be capable of functioning reliably at low temperatures, especially in applications like aerospace or automotive, where extreme cold environments may be encountered. Proper selection of materials and component testing for low-temperature performance are essential considerations.

3. Humidity and Moisture Resistance: Humidity can lead to corrosion and short circuits in electronic components. Sealing techniques, conformal coating, and moisture-resistant packaging should be employed to protect XC7A100T-2FGG676C and ensure its reliability in humid environments or outdoor applications.

4. Material Selection: Choosing appropriate materials for the PCB, components, and enclosure can mitigate the impact of environmental factors on XC7A100T-2FGG676C. Use of materials with high thermal conductivity, low moisture absorption, and good insulation properties is essential for robust system design.

Performance Analysis:

In real-world applications, XC7A100T-2FGG676C demonstrates remarkable performance and reliability, even in extreme environmental conditions. For instance, in industrial automation, where temperature variations are common, XC7A100T-2FGG676C based control systems exhibit stable operation and precise control over manufacturing processes.

Moreover, in aerospace and defense applications, XC7A100T-2FGG676C proves its reliability by withstanding high levels of vibration, shock, and temperature fluctuations without compromising performance. Its reconfigurable nature allows for flexibility in adapting to changing system requirements, making it suitable for mission-critical applications.

Conclusion:

In conclusion, XC7A100T-2FGG676C is a highly reliable FPGA that performs admirably in extreme environmental conditions with proper design considerations and implementation of thermal management, moisture protection, and material selection techniques. Its versatility and robustness make it a preferred choice for various embedded system applications where performance and reliability are paramount.

XC7A100T-2FGG676C FAQ

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6. What is the process for return or replacement of XC7A100T-2FGG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A100T-2FGG676C we delivered, we will accept the replacement or return of the XC7A100T-2FGG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A100T-2FGG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations