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Name: XC7A100T-2CSG324C
Brand: AMD Xilinx
SKU: XC7A100T-2CSG324C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC7A100T-2CSG324C

Part No.:: XC7A100T-2CSG324C

Manufacturer:: AMD Xilinx

Package:: 324-LFBGA, CSPBGA

Datasheet:: XC7A100T-2CSG324C.pdf

Description:: IC FPGA 210 I/O 324CSBGA

In Stock:: 2253

Quantity:: Add To Cart

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XC7A100T-2CSG324C Specifications

Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Series:
Artix-7
ProductStatus:
Active
NumberofLABs/CLBs:
7925
NumberofLogicElements/Cells:
101440
TotalRAMBits:
4976640
NumberofI/O:
210
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC7A100T-2CSG324C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC7A100T-2CSG324C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC7A100T-2CSG324C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC7A100T-2CSG324C information

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XC7A100T-2CSG324C performance and reliability evaluation in extreme environments

XC7A100T-2CSG324C is a field-programmable gate array (FPGA) renowned for its high performance and versatility, commonly utilized in a myriad of applications ranging from aerospace to telecommunications. Its robust architecture and extensive feature set make it suitable for deployment in extreme environmental conditions.

Environmental Considerations:

In designing systems incorporating XC7A100T-2CSG324C, engineers must meticulously consider various environmental factors to ensure optimal performance and reliability. These factors include:

- Temperature: The FPGA's operational temperature range is critical, as it must function reliably within specified limits, even in extreme heat or cold. Thermal management techniques such as heat sinks, fans, or liquid cooling may be employed to regulate temperature and prevent overheating or freezing.

- Humidity: High humidity levels can pose challenges for electronic components, leading to corrosion and degradation. Enclosures with appropriate sealing and moisture-resistant coatings help protect XC7A100T-2CSG324C from moisture ingress, ensuring long-term reliability.

- Vibration and Shock: In rugged environments such as aerospace or automotive applications, vibration and shock resistance are paramount. Secure mounting techniques and shock-absorbing materials safeguard the FPGA from mechanical stress, preserving its functionality under harsh conditions.

- Electromagnetic Interference (EMI): External electromagnetic fields can interfere with FPGA operation, leading to signal corruption or malfunction. Shielding measures and proper grounding techniques mitigate EMI effects, enhancing the electromagnetic compatibility of XC7A100T-2CSG324C-based systems.

- Radiation: In space or nuclear environments, ionizing radiation poses a significant threat to electronic devices. Radiation-hardened designs and materials, along with error-correcting codes (ECC), fortify XC7A100T-2CSG324C against radiation-induced errors, ensuring mission-critical reliability.

Performance Analysis:

Despite the formidable challenges posed by extreme environments, XC7A100T-2CSG324C demonstrates exceptional resilience and performance. In aerospace applications, where temperature variations and radiation levels are extreme, the FPGA reliably executes mission-critical tasks such as guidance, navigation, and control.

In industrial settings subject to high humidity and vibration, XC7A100T-2CSG324C maintains steadfast operation, powering automation systems and data processing units with unparalleled efficiency and accuracy.

Moreover, telecommunications infrastructure deployed in remote or harsh environments relies on XC7A100T-2CSG324C for robust signal processing and network management, ensuring uninterrupted connectivity and service reliability.

Conclusion:

Through meticulous design considerations and rigorous testing, XC7A100T-2CSG324C emerges as a stalwart performer in extreme environmental conditions. Its versatility, combined with advanced thermal, mechanical, and electromagnetic resilience, makes it the FPGA of choice for applications demanding uncompromising reliability and performance in the face of adversity.

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6. What is the process for return or replacement of XC7A100T-2CSG324C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7A100T-2CSG324C we delivered, we will accept the replacement or return of the XC7A100T-2CSG324C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7A100T-2CSG324C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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