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Name: XC6VSX475T-1FF1759I
Brand: AMD Xilinx
SKU: XC6VSX475T-1FF1759I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6VSX475T-1FF1759I

Part No.:: XC6VSX475T-1FF1759I

Manufacturer:: AMD Xilinx

Package:: 1759-BBGA, FCBGA

Datasheet:: XC6VSX475T-1FF1759I.pdf

Description:: IC FPGA 840 I/O 1759FCBGA

In Stock:: 2260

Quantity:: Add To Cart

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XC6VSX475T-1FF1759I Specifications

Package/Case:
1759-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex®-6 SXT
ProductStatus:
Active
NumberofLABs/CLBs:
37200
NumberofLogicElements/Cells:
476160
TotalRAMBits:
39223296
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC6VSX475T-1FF1759I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6VSX475T-1FF1759I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6VSX475T-1FF1759I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6VSX475T-1FF1759I information

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XC6VSX475T-1FF1759I application case analysis in emerging technology fields

XC6VSX475T-1FF1759I is a high-performance FPGA (Field-Programmable Gate Array) chip developed by Xilinx, offering extensive logic resources, memory, and I/O capabilities. Its advanced architecture makes it suitable for a wide range of applications, from telecommunications to aerospace.

Application Scenario:

In the aerospace industry, the XC6VSX475T-1FF1759I FPGA can be utilized for mission-critical tasks such as onboard data processing, communication protocol handling, and sensor interfacing in satellite systems.

System Architecture:

To design a satellite data processing system using XC6VSX475T-1FF1759I, the following architectural considerations are essential:

1. Data Acquisition:

Interface the FPGA with onboard sensors and instruments using high-speed serial interfaces such as PCIe or Gigabit Ethernet. Utilize the FPGA's configurable I/Os to adapt to various sensor protocols and data formats.

2. Data Processing:

Implement custom data processing algorithms and signal processing pipelines within the FPGA fabric. Utilize the parallel processing capabilities of XC6VSX475T-1FF1759I to achieve high throughput and low latency.

3. Communication:

Handle communication protocols such as TCP/IP or custom satellite communication protocols using dedicated IP cores or custom logic implemented in the FPGA. Ensure reliable and efficient data transmission between the satellite and ground stations.

4. Fault Tolerance:

Implement redundancy and error correction mechanisms within the FPGA design to ensure fault tolerance and reliable operation in the harsh space environment. Utilize built-in features such as partial reconfiguration to dynamically adapt to changing conditions.

5. Power Efficiency:

Optimize the FPGA design for power efficiency by minimizing unnecessary logic utilization and maximizing resource utilization. Implement power management techniques such as clock gating and dynamic voltage scaling to reduce power consumption during idle or low activity periods.

Considerations:

When designing the satellite data processing system, it's crucial to consider:

- Radiation Hardening: Ensure the FPGA design is resilient to radiation effects such as single-event upsets (SEUs) and total ionizing dose (TID) effects prevalent in the space environment.

- Thermal Management: Implement thermal management techniques to dissipate heat generated by the XC6VSX475T-1FF1759I FPGA and other onboard components to maintain optimal operating temperatures.

- System Integration: Coordinate with other subsystems such as power distribution, attitude control, and telemetry to ensure seamless integration and compatibility with the overall satellite architecture.

- Testing and Validation: Conduct rigorous testing and validation of the FPGA design using simulation tools, hardware-in-the-loop testing, and on-orbit testing to verify functionality, performance, and reliability before deployment.

XC6VSX475T-1FF1759I FAQ

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6. What is the process for return or replacement of XC6VSX475T-1FF1759I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6VSX475T-1FF1759I we delivered, we will accept the replacement or return of the XC6VSX475T-1FF1759I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6VSX475T-1FF1759I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations