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Name: XC6VLX365T-3FFG1156C
Brand: AMD Xilinx
SKU: XC6VLX365T-3FFG1156C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6VLX365T-3FFG1156C

Part No.:: XC6VLX365T-3FFG1156C

Manufacturer:: AMD Xilinx

Package:: 1156-BBGA, FCBGA

Datasheet:: XC6VLX365T-3FFG1156C.pdf

Description:: IC FPGA 600 I/O 1156FCBGA

In Stock:: 2885

Quantity:: Add To Cart

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XC6VLX365T-3FFG1156C Specifications

Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex®-6 LXT
ProductStatus:
Active
NumberofLABs/CLBs:
28440
NumberofLogicElements/Cells:
364032
TotalRAMBits:
15335424
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6VLX365T-3FFG1156C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6VLX365T-3FFG1156C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6VLX365T-3FFG1156C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6VLX365T-3FFG1156C information

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XC6VLX365T-3FFG1156C application case analysis in emerging technology fields

XC6VLX365T-3FFG1156C is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx, offering extensive logic capacity and versatile functionality. It features advanced programmable logic blocks, abundant memory resources, and high-speed serial transceivers, making it ideal for a wide range of applications requiring customizable digital logic processing.

Application Scenario:

In telecommunications infrastructure, XC6VLX365T-3FFG1156C can be utilized to implement advanced signal processing algorithms for real-time data transmission and reception in high-speed communication systems.

System Architecture:

To design a high-speed communication system using XC6VLX365T-3FFG1156C, follow these architectural considerations:

1. Digital Signal Processing:

Implement custom signal processing algorithms using the programmable logic blocks of XC6VLX365T-3FFG1156C to handle modulation, demodulation, error correction, and channel equalization tasks for efficient data transmission and reception.

2. Protocol Handling:

Utilize the FPGA's reconfigurable nature to support various communication protocols, such as Ethernet, PCIe, or custom proprietary protocols, enabling seamless integration into diverse networking environments.

3. High-Speed Interfaces:

Exploit the high-speed serial transceivers of XC6VLX365T-3FFG1156C to interface with external devices or network components at multi-gigabit per second data rates, ensuring efficient data exchange and minimal latency.

4. Parallel Processing:

Implement parallel processing architectures within the FPGA to handle multiple data streams simultaneously, increasing overall system throughput and reducing processing time for complex signal processing tasks.

5. Flexibility and Scalability:

Design the system with flexibility and scalability in mind, allowing for future upgrades or modifications by reprogramming the FPGA firmware to adapt to evolving communication standards or requirements.

Considerations:

When architecting the system, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize logic capacity and minimize resource conflicts for efficient implementation of complex algorithms.

- Timing Closure: Ensure timing closure is achieved during FPGA synthesis and place-and-route stages to meet critical timing requirements and maintain signal integrity in high-speed communication applications.

- Power Efficiency: Implement power management techniques, such as dynamic voltage and frequency scaling (DVFS) or clock gating, to minimize power consumption and heat dissipation in the FPGA-based communication system.

- Signal Integrity: Perform signal integrity analysis and simulation to mitigate signal reflections, crosstalk, and jitter issues in high-speed serial links, ensuring reliable data transmission over long distances.

- Compliance and Standards: Validate the system design against relevant industry standards, such as PCIe, Ethernet, or optical communication standards, to ensure interoperability and compliance with regulatory requirements.

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6. What is the process for return or replacement of XC6VLX365T-3FFG1156C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6VLX365T-3FFG1156C we delivered, we will accept the replacement or return of the XC6VLX365T-3FFG1156C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6VLX365T-3FFG1156C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations