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Name: XC6SLX9-N3CSG225C
Brand: AMD Xilinx
SKU: XC6SLX9-N3CSG225C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX9-N3CSG225C

Part No.:: XC6SLX9-N3CSG225C

Manufacturer:: AMD Xilinx

Package:: 225-LFBGA, CSPBGA

Datasheet:: XC6SLX9-N3CSG225C.pdf

Description:: IC FPGA 160 I/O 225CSBGA

In Stock:: 3150

Quantity:: Add To Cart

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XC6SLX9-N3CSG225C Specifications

Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
715
NumberofLogicElements/Cells:
9152
TotalRAMBits:
589824
NumberofI/O:
160
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX9-N3CSG225C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX9-N3CSG225C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX9-N3CSG225C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX9-N3CSG225C information

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XC6SLX9-N3CSG225C performance and reliability evaluation in extreme environments

XC6SLX9-N3CSG225C is a field-programmable gate array (FPGA) chip known for its versatility and reliability in various embedded system applications. This article explores its performance and reliability assessment in extreme environments, considering factors such as high temperature, low temperature, humidity, and more.

Environmental Considerations:

In the design process involving XC6SLX9-N3CSG225C, engineers must account for environmental factors to ensure optimal performance and longevity of the FPGA chip:

1. Thermal Management: Implement effective heat dissipation mechanisms to mitigate the impact of high temperatures on XC6SLX9-N3CSG225C. This may include heat sinks, fans, or thermal pads to maintain the chip within its specified operating temperature range.

2. Cold Temperature Operation: Evaluate the FPGA's performance under low-temperature conditions to ensure functionality and reliability, especially in applications subjected to freezing temperatures.

3. Humidity Control: Protect XC6SLX9-N3CSG225C from moisture and humidity, which can lead to corrosion or short circuits. Enclosures with proper sealing and desiccants may be employed to maintain dry conditions.

4. Vibration and Shock Resistance: Design the system to withstand mechanical stresses caused by vibrations or shocks, which could potentially damage the FPGA chip or its connections.

Performance Analysis:

In practical applications, XC6SLX9-N3CSG225C demonstrates robust performance even in harsh environments. Its key attributes include:

1. Versatility: The FPGA's reconfigurable nature allows for adaptation to diverse tasks and operating conditions, making it suitable for a wide range of applications.

2. Reliability: Despite challenging environmental conditions, XC6SLX9-N3CSG225C maintains stable operation and consistent functionality, ensuring uninterrupted system performance.

3. High Performance: The FPGA's high-speed processing capabilities enable rapid data processing and real-time responsiveness, essential for time-critical applications.

4. Scalability: XC6SLX9-N3CSG225C offers scalability in terms of logic capacity and I/O options, accommodating evolving project requirements and future expansions.

5. Design Flexibility: Engineers have the flexibility to customize and optimize designs to meet specific application needs, leveraging the FPGA's programmable logic resources.

Conclusion:

XC6SLX9-N3CSG225C exhibits commendable performance and reliability in extreme environments, reflecting its robust design and engineering excellence. By carefully considering environmental factors and employing appropriate mitigation strategies, designers can harness the full potential of this FPGA chip in demanding applications.

XC6SLX9-N3CSG225C FAQ

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6. What is the process for return or replacement of XC6SLX9-N3CSG225C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX9-N3CSG225C we delivered, we will accept the replacement or return of the XC6SLX9-N3CSG225C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX9-N3CSG225C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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