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Name: XC6SLX9-L1FTG256C
Brand: AMD Xilinx
SKU: XC6SLX9-L1FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX9-L1FTG256C

Part No.:: XC6SLX9-L1FTG256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XC6SLX9-L1FTG256C.pdf

Description:: IC FPGA 186 I/O 256FTBGA

In Stock:: 3836

Quantity:: Add To Cart

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XC6SLX9-L1FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
715
NumberofLogicElements/Cells:
9152
TotalRAMBits:
589824
NumberofI/O:
186
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX9-L1FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX9-L1FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX9-L1FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX9-L1FTG256C information

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XC6SLX9-L1FTG256C application case analysis in emerging technology fields

XC6SLX9-L1FTG256C is a field-programmable gate array (FPGA) device manufactured by Xilinx, offering high performance and flexibility for a wide range of applications. It features low power consumption, high-speed processing, and reconfigurability, making it suitable for diverse scenarios.

Application Scenario:

In the aerospace industry, XC6SLX9-L1FTG256C can be utilized for real-time image processing and analysis tasks onboard unmanned aerial vehicles (UAVs) or satellites. Its ability to process large volumes of data with minimal latency is crucial for applications such as object detection, terrain mapping, and target tracking.

System Architecture:

To implement real-time image processing using XC6SLX9-L1FTG256C, the system architecture should include the following components:

1. Image Sensor Interface:

Connect the image sensor, such as a CMOS or CCD camera, to the FPGA using appropriate interfaces like MIPI CSI or LVDS. Utilize the dedicated input pins of XC6SLX9-L1FTG256C to receive image data streams.

2. Processing Modules:

Implement processing modules within the FPGA fabric to perform tasks such as image filtering, edge detection, and object recognition. Utilize the programmable logic resources of XC6SLX9-L1FTG256C to parallelize and accelerate image processing algorithms.

3. Memory Interface:

Connect external memory devices, such as DDR SDRAM, to store intermediate results and image frames. Utilize the high-speed memory interface of XC6SLX9-L1FTG256C for efficient data transfer and buffering.

4. Communication Interface:

Implement communication interfaces, such as Ethernet or PCIe, to transfer processed data to external systems or ground stations. Utilize the built-in transceivers and SERDES capabilities of XC6SLX9-L1FTG256C for high-speed data transmission.

5. Power Management:

Ensure efficient power management within the system to minimize energy consumption and heat dissipation. Utilize dynamic power gating techniques and voltage scaling strategies to optimize power usage during idle and active states.

Considerations:

When designing the system, consider the following factors to ensure optimal performance and reliability:

- Resource Utilization: Efficiently utilize the programmable logic resources and DSP slices of XC6SLX9-L1FTG256C to maximize processing throughput and minimize resource contention.

- Timing Constraints: Analyze timing constraints and implement proper clock management strategies to meet critical timing requirements for real-time operation.

- Error Handling: Implement error detection and correction mechanisms to ensure data integrity and reliability, especially in harsh operating environments.

- Thermal Management: Incorporate thermal management techniques, such as heat sinks and airflow optimization, to prevent overheating and ensure long-term reliability of XC6SLX9-L1FTG256C in mission-critical applications.

- Verification and Testing: Thoroughly verify and test the system under various conditions to validate functionality, performance, and compliance with industry standards and specifications.

XC6SLX9-L1FTG256C FAQ

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3. Are the XC6SLX9-L1FTG256C price and inventory displayed accurate?

The price and inventory of XC6SLX9-L1FTG256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC6SLX9-L1FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX9-L1FTG256C we delivered, we will accept the replacement or return of the XC6SLX9-L1FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX9-L1FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations