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Name: XC6SLX9-3CPG196C
Brand: AMD Xilinx
SKU: XC6SLX9-3CPG196C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX9-3CPG196C

Part No.:: XC6SLX9-3CPG196C

Manufacturer:: AMD Xilinx

Package:: 196-TFBGA, CSBGA

Datasheet:: XC6SLX9-3CPG196C.pdf

Description:: IC FPGA 106 I/O 196CSBGA

In Stock:: 3014

Quantity:: Add To Cart

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XC6SLX9-3CPG196C Specifications

Package/Case:
196-TFBGA, CSBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
715
NumberofLogicElements/Cells:
9152
TotalRAMBits:
589824
NumberofI/O:
106
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX9-3CPG196C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX9-3CPG196C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX9-3CPG196C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX9-3CPG196C information

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XC6SLX9-3CPG196C performance and reliability evaluation in extreme environments

XC6SLX9-3CPG196C is a field-programmable gate array (FPGA) known for its versatility and reliability in various applications, including those operating in extreme environmental conditions. When designing with XC6SLX9-3CPG196C, careful consideration must be given to factors such as temperature, humidity, and other environmental variables to ensure optimal performance and reliability.

Environmental Considerations:

1. Temperature: One of the critical environmental factors affecting XC6SLX9-3CPG196C performance is temperature. The device must operate within specified temperature ranges to ensure proper functionality. Designers should incorporate thermal management techniques such as heatsinks, fans, or thermal pads to maintain the device temperature within acceptable limits, especially in high-temperature environments.

2. Humidity: High humidity levels can impact the reliability of electronic components, including XC6SLX9-3CPG196C. Designers should employ conformal coatings or encapsulation techniques to protect the FPGA from moisture ingress, reducing the risk of corrosion and electrical shorts.

3. Shock and Vibration: In applications subject to mechanical shock and vibration, such as automotive or aerospace systems, XC6SLX9-3CPG196C must be securely mounted and ruggedized to withstand these environmental stresses. Shock-absorbing mounts and vibration-resistant enclosures can help mitigate the impact of mechanical disturbances on the FPGA.

4. Radiation: In radiation-intensive environments such as space or nuclear applications, XC6SLX9-3CPG196C must be radiation-hardened or shielded to prevent radiation-induced bit flips or latch-up events. Radiation-tolerant packaging and error-correction techniques can enhance the reliability of the FPGA in these challenging environments.

Performance Analysis:

XC6SLX9-3CPG196C has demonstrated robust performance in a wide range of applications, including industrial automation, telecommunications, and defense systems. Its high logic density, configurable I/O capabilities, and low power consumption make it suitable for diverse use cases.

In industrial automation, XC6SLX9-3CPG196C can be deployed in control systems for process monitoring and control. Its reprogrammable nature allows for flexibility in adapting to changing production requirements, while its reliability ensures continuous operation in harsh industrial environments.

In telecommunications infrastructure, XC6SLX9-3CPG196C serves as a key component in network switches, routers, and base station equipment. Its high-speed serial interfaces and DSP capabilities enable efficient data processing and communication, contributing to the overall performance and reliability of telecommunications networks.

In defense and aerospace applications, XC6SLX9-3CPG196C is utilized in radar systems, avionics, and mission-critical control systems. Its ruggedized design and radiation-hardened options ensure dependable operation in challenging environments, providing essential functionality for mission success and safety.

Conclusion:

In conclusion, XC6SLX9-3CPG196C exhibits excellent performance and reliability in extreme environmental conditions when appropriately designed and deployed. By considering environmental factors such as temperature, humidity, shock, and radiation, designers can ensure the optimal operation of XC6SLX9-3CPG196C in diverse applications, ranging from industrial automation to aerospace systems.

XC6SLX9-3CPG196C FAQ

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6. What is the process for return or replacement of XC6SLX9-3CPG196C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX9-3CPG196C we delivered, we will accept the replacement or return of the XC6SLX9-3CPG196C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX9-3CPG196C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations