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Name: XC6SLX75-3FGG676I
Brand: AMD Xilinx
SKU: XC6SLX75-3FGG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX75-3FGG676I

Part No.:: XC6SLX75-3FGG676I

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XC6SLX75-3FGG676I.pdf

Description:: IC FPGA 408 I/O 676FBGA

In Stock:: 2995

Quantity:: Add To Cart

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XC6SLX75-3FGG676I Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
5831
NumberofLogicElements/Cells:
74637
TotalRAMBits:
3170304
NumberofI/O:
408
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC6SLX75-3FGG676I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX75-3FGG676I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX75-3FGG676I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX75-3FGG676I information

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XC6SLX75-3FGG676I performance and reliability evaluation in extreme environments

XC6SLX75-3FGG676I is a field-programmable gate array (FPGA) manufactured by Xilinx, offering high-performance processing capabilities and versatile programmability. This FPGA is designed to operate reliably in a wide range of environmental conditions, making it suitable for applications where extreme temperatures, humidity, and other factors are prevalent.

Environmental Considerations:

In the design of systems utilizing XC6SLX75-3FGG676I, several environmental factors must be considered to ensure optimal performance and reliability:

- Temperature: The XC6SLX75-3FGG676I is designed to operate within specified temperature ranges. Adequate thermal management techniques, such as heat sinks or fans, may be necessary to maintain temperatures within acceptable limits, especially in high-temperature environments.

- Humidity: Excessive humidity can potentially affect the performance of electronic components. Enclosures with proper sealing and humidity control measures may be required to protect the XC6SLX75-3FGG676I from moisture-related damage.

- Shock and Vibration: In applications subject to mechanical shock or vibration, the FPGA and associated components should be securely mounted and mechanically reinforced to withstand such stresses.

- Altitude: At high altitudes, changes in atmospheric pressure can impact the behavior of electronic components. The design should account for altitude-related effects to ensure reliable operation.

- Radiation: For applications in radiation-prone environments, such as space or nuclear facilities, radiation-hardened versions of the XC6SLX75-3FGG676I may be necessary to prevent performance degradation or failure.

Performance in Practical Applications:

The XC6SLX75-3FGG676I has demonstrated robust performance in a variety of real-world applications, including but not limited to:

- Aerospace and Defense: In avionics systems, the XC6SLX75-3FGG676I is utilized for signal processing, communication, and control tasks, where reliability and performance are critical even in harsh environmental conditions.

- Industrial Automation: In manufacturing environments, the XC6SLX75-3FGG676I is employed for process control, machine vision, and data acquisition, operating reliably despite temperature variations and electrical noise.

- Automotive Electronics: The XC6SLX75-3FGG676I finds application in automotive electronics for functions such as engine control, driver assistance systems, and infotainment, demonstrating resilience to temperature extremes and vibration.

- Telecommunications: Within telecommunications infrastructure, the XC6SLX75-3FGG676I is used for signal processing, baseband processing, and protocol implementation, maintaining performance integrity under varying environmental conditions.

- Research and Development: Researchers and engineers leverage the XC6SLX75-3FGG676I in experimental setups and prototyping, where its flexibility and reliability enable exploration and innovation across diverse domains.

In conclusion, the XC6SLX75-3FGG676I FPGA is designed to deliver reliable performance in extreme environmental conditions, with careful consideration of factors such as temperature, humidity, shock, and radiation. Its proven track record in various applications underscores its suitability for demanding environments where robustness and performance are paramount.

XC6SLX75-3FGG676I FAQ

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3. Are the XC6SLX75-3FGG676I price and inventory displayed accurate?

The price and inventory of XC6SLX75-3FGG676I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC6SLX75-3FGG676I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX75-3FGG676I we delivered, we will accept the replacement or return of the XC6SLX75-3FGG676I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX75-3FGG676I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations