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Name: XC6SLX75-2FGG676C
Brand: Xilinx Inc.
SKU: XC6SLX75-2FGG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC6SLX75-2FGG676C

Part No.:: XC6SLX75-2FGG676C

Manufacturer:: Xilinx Inc.

Package:: 676-BGA

Datasheet:: XC6SLX75-2FGG676C.pdf

Description:: IC FPGA 408 I/O 676FBGA

In Stock:: 2744

Quantity:: Add To Cart

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XC6SLX75-2FGG676C Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
5831
NumberofLogicElements/Cells:
74637
TotalRAMBits:
3170304
NumberofI/O:
408
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

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XC6SLX75-2FGG676C information

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XC6SLX75-2FGG676C Typical application Circuitry

XC6SLX75-2FGG676C

Hailing from Xilinx's lauded Spartan-6 family of Field Programmable Gate Arrays (FPGAs), the XC6SLX75-2FGG676C stands as a high-performance integrated circuit. As an FPGA, it can be programmed post-production to perform a wide array of digital processing tasks.

Functional Proficiency and Application Scenarios: With its inherent programmability, the XC6SLX75-2FGG676C has found applications across various fields. These include but are not limited to, digital signal processing, embedded systems, video and image processing, and high-speed communications. It can be custom-tailored to suit a multitude of unique computational tasks or logic functions.

Key Characteristics and Specifications: The XC6SLX75-2FGG676C is equipped with 74,400 logic cells, 3,696 Kbits of block RAM, and 180 DSP48A1 slices. It operates within a temperature range of -40 °C to +100 °C and is housed in a 676-ball fine-pitch BGA package. The FPGA also supports various I/O standards, including but not limited to LVCMOS, LVTTL, PCI, and more.

Exemplary Application and Detailed Circuit Connection

Let's consider an application where the XC6SLX75-2FGG676C is utilized in a bespoke digital signal processing (DSP) system.

1. Power Connectivity: Vital connections include the VCCINT pins (e.g., VCCINT_F10, VCCINT_F11), linked to a 1.2V power supply. The VCCAUX pins (e.g., VCCAUX_F15, VCCAUX_G14) are to be connected to a 2.5V or 3.3V power supply, depending on the I/O standards in use. Additionally, connecting all GND pins to the ground is a prerequisite for establishing a common ground.

2. JTAG Interface Connections: For device programming and debugging, the JTAG pins (TDI: TDI_D1, TDO: TDO_C1, TCK: TCK_A1, TMS: TMS_D1) come into play. It is generally recommended to pull up the TMS and TDI pins to the VCCAUX through a 10K ohm resistor.

3. I/O Pin Connections: Configuration of these pins can be customized as per application needs. If a DSP system is the use case, some of these I/O pins could be assigned to ADC/DAC data, control signals, and the like.

4. Configuration Pins: Pins such as PROGRAM_B (PROGRAM_B_J20), INIT_B (INIT_B_H19), and DONE (DONE_J18) are pivotal for device configuration. Typically, PROGRAM_B and INIT_B pins are pulled up while the DONE pin is kept under observation to ensure successful FPGA configuration.

Design Considerations

When designing circuits with the XC6SLX75-2FGG676C, the following aspects need due consideration:

1. Power Sequencing: It is vital to sequence power supplies correctly to ensure the FPGA's functionality.

2. Decoupling Capacitors: Positioning these capacitors close to the power pins aids in filtering noise and promoting stable operation.

3. Clock Distribution: Proper distribution of the clock signal with minimal skew is crucial for synchronous operations.

4. Thermal Management: FPGAs can generate a considerable amount of heat, making effective thermal management solutions a necessity.

5. Signal Integrity: To prevent issues such as cross-talk or signal reflections, employ appropriate PCB layout techniques and termination methods.

In conclusion, the XC6SLX75-2FGG676C presents itself as a highly adaptable platform that can accommodate an array of digital computation tasks. Due to its extensive feature set, it is a suitable option for a wide range of applications.

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6. What is the process for return or replacement of XC6SLX75-2FGG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX75-2FGG676C we delivered, we will accept the replacement or return of the XC6SLX75-2FGG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX75-2FGG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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