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Name: XC6SLX4-L1CSG225C
Brand: AMD Xilinx
SKU: XC6SLX4-L1CSG225C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX4-L1CSG225C

Part No.:: XC6SLX4-L1CSG225C

Manufacturer:: AMD Xilinx

Package:: 225-LFBGA, CSPBGA

Datasheet:: XC6SLX4-L1CSG225C.pdf

Description:: IC FPGA 132 I/O 225CSBGA

In Stock:: 2415

Quantity:: Add To Cart

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XC6SLX4-L1CSG225C Specifications

Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
300
NumberofLogicElements/Cells:
3840
TotalRAMBits:
221184
NumberofI/O:
132
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX4-L1CSG225C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX4-L1CSG225C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX4-L1CSG225C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX4-L1CSG225C information

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XC6SLX4-L1CSG225C performance and reliability evaluation in extreme environments

XC6SLX4-L1CSG225C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, designed to offer high performance and flexibility for a wide range of applications. This article explores its performance and reliability assessment in extreme environmental conditions, including high temperature, low temperature, humidity, and more.

Environmental Considerations:

In designing with XC6SLX4-L1CSG225C, environmental factors play a crucial role in ensuring optimal performance and reliability. Here are key considerations:

- High Temperature: The FPGA's ability to withstand high temperatures is essential, particularly in applications such as automotive, aerospace, or industrial settings where temperature fluctuations are common. Thorough thermal analysis and proper heat dissipation techniques must be implemented to prevent overheating and maintain stable operation.

- Low Temperature: Extreme cold can impact the functionality of electronic components, including FPGAs. It's crucial to ensure that XC6SLX4-L1CSG225C can operate reliably in low-temperature environments, such as in outdoor installations or cold storage facilities. Cold temperature testing and component selection for extended temperature range operation are necessary.

- Humidity: High humidity levels can lead to condensation and moisture ingress, potentially causing corrosion and electrical shorts in sensitive electronic components like FPGAs. Designing with conformal coating and moisture-resistant materials can mitigate these risks and enhance the reliability of XC6SLX4-L1CSG225C in humid environments.

- Vibration and Shock: In applications subject to vibration and mechanical shock, such as automotive or aerospace systems, the mechanical robustness of XC6SLX4-L1CSG225C is critical. Proper PCB layout and mounting techniques, along with ruggedized packaging options, can ensure the FPGA's integrity under such conditions.

- Radiation: In radiation-intensive environments like space or nuclear applications, radiation-hardened FPGAs may be required to withstand ionizing radiation effects. While XC6SLX4-L1CSG225C may not be inherently radiation-hardened, additional shielding and error-correction techniques can be employed to enhance its resilience in radiation-prone environments.

Performance in Practical Applications:

Despite the challenges posed by extreme environmental conditions, XC6SLX4-L1CSG225C demonstrates robust performance and reliability in various real-world applications. For instance:

- In automotive electronics, XC6SLX4-L1CSG225C powers advanced driver assistance systems (ADAS), providing real-time processing capabilities for features like collision avoidance and lane departure warning.

- In industrial automation, the FPGA enables high-speed control and monitoring of manufacturing processes, ensuring precision and efficiency even in harsh operating environments with temperature fluctuations and humidity variations.

- In aerospace and defense systems, XC6SLX4-L1CSG225C facilitates mission-critical functions such as radar signal processing, communications, and guidance systems, demonstrating resilience to vibration, shock, and temperature extremes.

- In telecommunications infrastructure, the FPGA supports data processing and networking tasks, delivering reliable performance in both indoor and outdoor installations subject to environmental variations.

Conclusion:

XC6SLX4-L1CSG225C offers a versatile solution for applications demanding high performance and reliability in extreme environmental conditions. By addressing environmental factors during design and testing, engineers can ensure the FPGA's robustness and longevity in diverse real-world scenarios, ultimately enhancing the success of their projects.

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6. What is the process for return or replacement of XC6SLX4-L1CSG225C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX4-L1CSG225C.

(3)The PartNo is unused and only in the original unpacked packaging.

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