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Name: XC6SLX4-3CSG225C
Brand: AMD Xilinx
SKU: XC6SLX4-3CSG225C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX4-3CSG225C

Part No.:: XC6SLX4-3CSG225C

Manufacturer:: AMD Xilinx

Package:: 225-LFBGA, CSPBGA

Datasheet:: XC6SLX4-3CSG225C.pdf

Description:: IC FPGA 132 I/O 225CSBGA

In Stock:: 2462

Quantity:: Add To Cart

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XC6SLX4-3CSG225C Specifications

Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
300
NumberofLogicElements/Cells:
3840
TotalRAMBits:
221184
NumberofI/O:
132
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX4-3CSG225C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX4-3CSG225C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX4-3CSG225C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX4-3CSG225C information

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XC6SLX4-3CSG225C performance and reliability evaluation in extreme environments

XC6SLX4-3CSG225C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, known for its reliability and versatility in various applications. In this article, we will explore its performance and reliability assessment in extreme environmental conditions, including high temperature, low temperature, humidity, and more.

Environmental Considerations:

When designing with XC6SLX4-3CSG225C, engineers must consider the following environmental factors to ensure optimal performance and reliability:

- High Temperature: The FPGA should be capable of operating reliably at elevated temperatures, ensuring that the circuitry remains functional even in harsh industrial or automotive environments where high temperatures are common.

- Low Temperature: Similarly, the FPGA should be able to withstand low temperatures without degradation in performance, ensuring continued operation in cold storage or aerospace applications.

- Humidity: Proper sealing and conformal coating may be necessary to protect the XC6SLX4-3CSG225C from moisture ingress, preventing corrosion or short circuits, especially in outdoor or marine applications.

- Vibration and Shock: Mechanical robustness is essential to withstand vibrations and shocks encountered in automotive or aerospace environments, preventing solder joint failures or damage to internal components.

- Radiation: In space or nuclear applications, the FPGA must be radiation-hardened to mitigate the effects of ionizing radiation, ensuring reliable operation in radiation-rich environments.

Performance Evaluation:

In practical applications, XC6SLX4-3CSG225C demonstrates exceptional performance and reliability, even in extreme environmental conditions. Its features, including high-speed interfaces, ample logic resources, and robust built-in error-checking mechanisms, make it suitable for a wide range of applications.

- Industrial Automation: In industrial automation, XC6SLX4-3CSG225C can be used for real-time control and monitoring tasks, providing rapid response and precise data processing even in harsh factory environments.

- Aerospace and Defense: In aerospace and defense systems, XC6SLX4-3CSG225C offers reliable performance under extreme temperatures, vibrations, and radiation, ensuring mission-critical functionality in satellites, aircraft, and military equipment.

- Automotive Electronics: In automotive electronics, XC6SLX4-3CSG225C enables advanced driver assistance systems (ADAS), infotainment, and engine control units (ECUs), providing high-speed processing and robust operation in automotive environments subject to temperature variations and mechanical stress.

Conclusion:

XC6SLX4-3CSG225C excels in performance and reliability, even in extreme environmental conditions, making it a preferred choice for designers across various industries. By considering environmental factors during the design phase and leveraging the FPGA's inherent capabilities, engineers can ensure the successful deployment of robust and resilient systems for diverse applications.

XC6SLX4-3CSG225C FAQ

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3. Are the XC6SLX4-3CSG225C price and inventory displayed accurate?

The price and inventory of XC6SLX4-3CSG225C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC6SLX4-3CSG225C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX4-3CSG225C we delivered, we will accept the replacement or return of the XC6SLX4-3CSG225C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX4-3CSG225C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations