XC6SLX25-3FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX25-3FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX25-3FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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Functionality and Use-Cases: The XC6SLX25-3FTG256I excels in various application scenarios, including but not limited to embedded systems, digital signal processing, high-speed connectivity, and image or video processing. Its inherent programmability makes it well-suited for specialized computational tasks and logic-intensive operations.
Key Parameters and Features: In terms of features, the XC6SLX25-3FTG256I contains 24,576 logic cells, 14,579 logic elements, 1,296 Kbits of block RAM, and 54 DSP slices. It operates within a temperature range of -40 °C to +100 °C and comes in a 256-pin thin flat package. The FPGA is capable of supporting a variety of I/O standards such as LVCMOS, LVTTL, HSTL, SSTL, and more.
Example of Application and Circuit Connections
Consider the FPGA being utilized in a data acquisition system.
1. Power Supply Connections: Power supply pins such as VCCINT (e.g., VCCINT_B12, VCCINT_C11) should be connected to a 1.2V source. The VCCAUX pins (e.g., VCCAUX_B14, VCCAUX_A13) need to be tied to a 2.5V or 3.3V source, depending on the I/O standards employed. All GND pins must be grounded.
2. JTAG Interface Connections: For programming and debugging the FPGA, a JTAG interface is essential. The TDI (TDI_E1), TDO (TDO_D2), TCK (TCK_D1), and TMS (TMS_E2) pins from this interface. Pull-up resistors of approximately 10K to VCCAUX are advisable on the TMS and TDI pins.
3. I/O Pin Connections: The specific requirements of the data acquisition application will dictate the assignment of the I/O pins. Some might be used for data input/output, while others for control signals.
4. Configuration Pins: Pins like PROGRAM_B (PROGRAM_B_H4), INIT_B (INIT_B_H2), and DONE (DONE_G2) are key for FPGA configuration. Typically, PROGRAM_B and INIT_B are pulled up, while the DONE pin is used to confirm a successful FPGA configuration.
Circuit Design Considerations
Designing circuits with the XC6SLX25-3FTG256I requires attention to several factors:
1. Power Sequencing: Correct power-up sequence is vital for the FPGA's proper operation.
2. Decoupling Capacitors: To filter noise and maintain stability, decoupling capacitors should be placed close to power pins.
3. Clock Distribution: To minimize skew in synchronous operations, careful clock signal distribution is important.
4. Thermal Management: High power dissipation of FPGAs necessitates effective thermal management.
5. Signal Integrity: Proper PCB layout techniques and termination methods are crucial to avoid issues like cross-talk or signal reflections.
In summary, the XC6SLX25-3FTG256I FPGA offers a flexible and high-performance solution for a variety of demanding applications.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX25-3FTG256I we delivered, we will accept the replacement or return of the XC6SLX25-3FTG256I only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX25-3FTG256I.
(3)The PartNo is unused and only in the original unpacked packaging.
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(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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