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Name: XC6SLX25-2FGG484I
Brand: Xilinx Inc.
SKU: XC6SLX25-2FGG484I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC6SLX25-2FGG484I

Part No.:: XC6SLX25-2FGG484I

Manufacturer:: Xilinx Inc.

Package:: 484-BBGA

Datasheet:: XC6SLX25-2FGG484I.pdf

Description:: IC FPGA 266 I/O 484FBGA

In Stock:: 3735

Quantity:: Add To Cart

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XC6SLX25-2FGG484I Specifications

Package/Case:
484-BBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
1879
NumberofLogicElements/Cells:
24051
TotalRAMBits:
958464
NumberofI/O:
266
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

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XC6SLX25-2FGG484I information

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XC6SLX25-2FGG484I Typical application Circuitry

XC6SLX25-2FGG484I

The XC6SLX25-2FGG484I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx's Spartan-6 series. FPGAs are intrinsically programmable pieces of digital logic that can be set up for a variety of uses.

Functionality and Application Scenarios: The XC6SLX25-2FGG484I is intended for use in various high-performance applications, such as digital signal processing, embedded systems, high-speed communications, and image or video processing. The FPGA's programmable nature makes it particularly versatile in specialized computational or logic tasks.

Key Specifications and Features: The XC6SLX25-2FGG484I incorporates 24,576 Logic Cells, 15,360 Logic Elements, 1,296 Kbits of block RAM, and 54 DSP slices. The FPGA operates over a temperature range of -40 °C to +100 °C and is delivered in a 484-pin fine-pitch BGA package. It supports a variety of I/O standards such as LVCMOS, LVTTL, HSTL, and SSTL, among others.

Application Scenario and Circuit Connections

In this scenario, let's focus on a digital signal processing system application:

1. Power Supply Connections: The VCCINT pins (e.g., VCCINT_C10, VCCINT_D11) should be connected to a 1.2V power supply. The VCCAUX pins (e.g., VCCAUX_C12, VCCAUX_D13) should be tied to either a 2.5V or 3.3V power supply, based on the I/O standards in use. All GND pins must be grounded.

2. JTAG Interface Connections: The JTAG interface is crucial for programming and debugging the FPGA. This interface includes TDI (TDI_B3), TDO (TDO_A3), TCK (TCK_A4), and TMS (TMS_B4) pins. Pull-ups of around 10K resistors to VCCAUX are recommended on TMS and TDI pins.

3. I/O Pin Connections: I/O pins are assigned as per the specific requirements of the digital signal processing application. For instance, some I/O pins could be employed for digital audio data, clock signals, or control signals.

4. Configuration Pins: The configuration pins such as PROGRAM_B (PROGRAM_B_G5), INIT_B (INIT_B_F6), and DONE (DONE_E6) are crucial for FPGA configuration. Typically, PROGRAM_B and INIT_B are pulled up, while the DONE pin is monitored to confirm successful FPGA configuration.

Circuit Design Considerations

When designing circuits with the XC6SLX25-2FGG484I, several factors need careful consideration:

1. Power Sequencing: Proper power-up sequence is critical for the normal operation of the FPGA.

2. Decoupling Capacitors: Placing decoupling capacitors close to the power pins can help filter noise and maintain stable operation.

3. Clock Distribution: When distributing the clock signal for synchronous operations, it is essential to minimize skew.

4. Thermal Management: Given that FPGAs can dissipate significant power, effective thermal management is a must.

5. Signal Integrity: To avoid problems such as cross-talk or signal reflections, it's crucial to use proper PCB layout techniques and termination methods.

In conclusion, the XC6SLX25-2FGG484I FPGA is a flexible and powerful solution that caters to a wide range of high-performance applications.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX25-2FGG484I.

(3)The PartNo is unused and only in the original unpacked packaging.

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