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Name: XC6SLX25-2CSG324C
Brand: Xilinx Inc.
SKU: XC6SLX25-2CSG324C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC6SLX25-2CSG324C

Part No.:: XC6SLX25-2CSG324C

Manufacturer:: Xilinx Inc.

Package:: 324-LFBGA, CSPBGA

Datasheet:: XC6SLX25-2CSG324C.pdf

Description:: IC FPGA 226 I/O 324CSBGA

In Stock:: 2860

Quantity:: Add To Cart

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XC6SLX25-2CSG324C Specifications

Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
1879
NumberofLogicElements/Cells:
24051
TotalRAMBits:
958464
NumberofI/O:
226
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX25-2CSG324C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX25-2CSG324C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX25-2CSG324C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX25-2CSG324C information

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XC6SLX25-2CSG324C Typical application Circuitry

XC6SLX25-2CSG324C

The XC6SLX25-2CSG324C is a sophisticated Field Programmable Gate Array (FPGA) that is a part of the Spartan-6 family by Xilinx. These FPGAs are flexible integrated circuits designed for the implementation of custom digital logic.

Functionality and Application Scenarios: The XC6SLX25-2CSG324C is versatile and capable of achieving high performance in a wide range of applications. These can include but are not limited to, digital signal processing, video and image processing, high-speed communications, and embedded systems.

Key Specifications and Features: In terms of specifications, the XC6SLX25-2CSG324C comes with 24,576 logic cells, 15,360 logic elements, 1,296 Kbits of block RAM, and 54 DSP slices. It operates within a temperature range of -40 °C to +100 °C and is housed in a 324-pin chip scale BGA package. The device supports various I/O standards such as LVCMOS, LVTTL, HSTL, SSTL, and more.

Application Scenario and Circuit Connections

Imagine an application where the XC6SLX25-2CSG324C FPGA is utilized in a video processing system.

1. Power Supply Connections: Connect the VCCINT pins (like VCCINT_A12, VCCINT_B13) to a 1.2V power supply and VCCAUX pins (like VCCAUX_A14, VCCAUX_B14) to either a 2.5V or 3.3V power supply depending on the I/O standards being utilized. The ground must be connected to each and every GND pin.

2. JTAG Interface Connections: The JTAG interface is essential for device programming and debugging. This includes TDI (TDI_F2), TDO (TDO_F1), TCK (TCK_E2), and TMS (TMS_E1) pins. It is often recommended to pull up the TMS and TDI pins via a 10K resistor to VCCAUX.

3. I/O Pin Connections: Depending on the specific requirements of the application, I/O pins can be assigned accordingly. In a video processing system, specific I/O pins might be assigned for digital video signals, clock signals, synchronization signals, etc.

4. Configuration Pins: The configuration pins, including PROGRAM_B (PROGRAM_B_H3), INIT_B (INIT_B_H2), and DONE (DONE_H1) pins, are crucial for device configuration. Typically, PROGRAM_B and INIT_B are pulled up, while the DONE pin is monitored to verify the successful FPGA configuration.

Circuit Design Considerations

When developing circuits with XC6SLX25-2CSG324C, it's vital to consider the following aspects:

1. Power Sequencing: Correct sequencing of power supplies is crucial for the proper functionality of the chip.

2. Decoupling Capacitors: It's advisable to place decoupling capacitors near the power pins to filter out noise and ensure stable operation.

3. Clock Distribution: Minimizing skew while distributing the clock signal is essential for synchronous operations.

4. Thermal Management: The FPGA can potentially dissipate significant power, necessitating efficient thermal management strategies.

5. Signal Integrity: Proper PCB layout techniques and termination methods should be employed to prevent issues like cross-talk or signal reflections.

The XC6SLX25-2CSG324C presents a highly customizable and high-performing platform for a multitude of digital computation tasks, making it a versatile tool for a wide range of applications.

XC6SLX25-2CSG324C FAQ

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6. What is the process for return or replacement of XC6SLX25-2CSG324C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX25-2CSG324C we delivered, we will accept the replacement or return of the XC6SLX25-2CSG324C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX25-2CSG324C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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