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Name: XC6SLX16-2FTG256C
Brand: Xilinx Inc.
SKU: XC6SLX16-2FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC6SLX16-2FTG256C

Part No.:: XC6SLX16-2FTG256C

Manufacturer:: Xilinx Inc.

Package:: 256-LBGA

Datasheet:: XC6SLX16-2FTG256C.pdf

Description:: IC FPGA 186 I/O 256FTBGA

In Stock:: 2238

Quantity:: Add To Cart

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XC6SLX16-2FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
1139
NumberofLogicElements/Cells:
14579
TotalRAMBits:
589824
NumberofI/O:
186
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX16-2FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX16-2FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX16-2FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX16-2FTG256C information

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XC6SLX16-2FTG256C Typical application Circuitry

XC6SLX16-2FTG256C

The XC6SLX16-2FTG256C is an advanced Field Programmable Gate Array (FPGA) from Xilinx, a part of the Spartan-6 series. FPGAs are adaptable integrated circuits designed to execute a wide range of digital computations.

Functionality and Application Scenarios: The XC6SLX16-2FTG256C is built for high performance across various application areas, such as embedded systems, video processing, digital signal processing, and high-speed communications. Due to its reprogrammable nature, it is ideally suited for a wide array of specialized computational or logic tasks.

Key Specifications and Features: The XC6SLX16-2FTG256C FPGA offers 14,579 Logic Cells, 9,152 Logic Elements, 576 Kbits of block RAM, and 32 DSP slices. The chip operates within a temperature range of -40 °C to +100 °C and features a 256-pin thin quad flat pack (TQFP) package. The device also supports various I/O standards such as LVCMOS, LVTTL, HSTL, SSTL, etc.

Application Scenario and Circuit Connections

Let's consider an application scenario where the XC6SLX16-2FTG256C FPGA is utilized in an embedded system for motor control.

1. Power Supply Connections: The VCCINT pins (like VCCINT_B12, and VCCINT_C13) should be tied to a 1.2V power supply. VCCAUX pins (like VCCAUX_A14, and VCCAUX_B14) should be connected to a 2.5V or 3.3V power supply depending on the utilized I/O standards. All GND pins must be linked to the ground.

2. JTAG Interface Connections: The JTAG interface is fundamental for device programming and debugging. The JTAG connections include TDI (TDI_C3), TDO (TDO_B3), TCK (TCK_A3), and TMS (TMS_A4). A 10K resistor to VCCAUX is suggested for pull-ups on the TMS and TDI pins.

3. I/O Pin Connections: I/O pins can be assigned as per the requirements of the application. For example, in motor control applications, certain I/O pins could be used for PWM signals, limit switches, and motor feedback signals.

4. Configuration Pins: The configuration pins like PROGRAM_B (PROGRAM_B_E2), INIT_B (INIT_B_D2), and DONE (DONE_E1) are necessary for device configuration. In a typical setup, PROGRAM_B and INIT_B are pulled up, while the DONE pin is checked to ensure successful FPGA configuration.

Circuit Design Considerations

When working with circuits involving the XC6SLX16-2FTG256C, several crucial factors should be taken into account:

1. Power Sequencing: Proper sequencing of the power supplies is essential for the chip's correct functionality.

2. Decoupling Capacitors: Placement of decoupling capacitors near the power pins helps filter out noise and ensures stable operation.

3. Clock Distribution: For synchronous operations, it is crucial to distribute the clock signal with minimum skew.

4. Thermal Management: Effective thermal management solutions are necessary due to the potential for significant power dissipation from the FPGA.

5. Signal Integrity: Proper PCB layout techniques and termination methods are crucial for preventing issues such as cross-talk or signal reflections.

The XC6SLX16-2FTG256C offers a flexible and robust platform for diverse digital computation tasks, equipped with a powerful set of features suitable for a range of applications.

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6. What is the process for return or replacement of XC6SLX16-2FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX16-2FTG256C we delivered, we will accept the replacement or return of the XC6SLX16-2FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX16-2FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations