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Name: XC6SLX150-3FGG484C
Brand: Xilinx Inc.
SKU: XC6SLX150-3FGG484C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XC6SLX150-3FGG484C

Part No.:: XC6SLX150-3FGG484C

Manufacturer:: Xilinx Inc.

Package:: 484-BBGA

Datasheet:: XC6SLX150-3FGG484C.pdf

Description:: IC FPGA 338 I/O 484FBGA

In Stock:: 2659

Quantity:: Add To Cart

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XC6SLX150-3FGG484C Specifications

Package/Case:
484-BBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
11519
NumberofLogicElements/Cells:
147443
TotalRAMBits:
4939776
NumberofI/O:
338
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX150-3FGG484C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX150-3FGG484C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX150-3FGG484C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX150-3FGG484C information

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XC6SLX150-3FGG484C Typical application Circuitry

XC6SLX150-3FGG484C

The XC6SLX150-3FGG484C is a potent Field Programmable Gate Array (FPGA) chip, part of the Spartan-6 series, manufactured by Xilinx. FPGAs are customizable integrated circuits that are tailored to carry out numerous digital computation tasks.

Functionality and Application Scenarios: The XC6SLX150-3FGG484C is engineered for peak performance across a variety of applications such as high-speed communications, video and image processing, digital signal processing, and embedded systems. Thanks to its re-programmability, it's particularly suitable for an array of specialized computational or logic operations.

Key Specifications and Features: This FPGA chip boasts 147,443 Logic Cells, 92,057 Logic Elements, 4,824 Kbits of block RAM, and 180 DSP slices. It operates within a temperature range from -40 °C to +100 °C and sports a 484-pin flip-chip BGA packaging. It is also compatible with various I/O standards including LVCMOS, LVTTL, HSTL, SSTL, and more.

Application Scenario and Circuit Connections

Suppose we're using the XC6SLX150-3FGG484C FPGA to develop a high-speed communication system.

1. Power Supply Connections: Pins VCCINT (like VCCINT_B8, VCCINT_C8) must be linked to a 1.2V power supply, while VCCAUX (like VCCAUX_A9, VCCAUX_B9) should be connected to a 2.5V or 3.3V power supply, based on the I/O standards in use. It's crucial that all GND pins are connected to the ground.

2. JTAG Interface Connections: The JTAG interface is vital for device programming and debugging. The JTAG connections encompass TDI (TDI_B2), TDO (TDO_A2), TCK (TCK_B1), and TMS (TMS_A1). It is generally advisable to pull up the TMS and TDI pins via a 10K resistor to VCCAUX.

3. I/O Pin Connections: I/O pins can be set up to precisely match the application's requirements. In a high-speed communication system scenario, specific I/O pins might be designated for data, clock signals, control signals, etc.

4. Configuration Pins: Configuration pins like PROGRAM_B (PROGRAM_B_D3), INIT_B (INIT_B_D2), and DONE (DONE_D1) are critical for device configuration. Generally, PROGRAM_B and INIT_B are pulled up while the DONE pin is monitored to ensure successful FPGA configuration.

Circuit Design Considerations

While designing circuits with XC6SLX150-3FGG484C, the following factors should be given due consideration:

1. Power Sequencing: Proper sequencing of power supplies is essential to ensure the chip's correct functionality.

2. Decoupling Capacitors: Decoupling capacitors should be positioned close to the power pins in order to filter out noise and guarantee stable operation.

3. Clock Distribution: For synchronous operations, the clock signal should be distributed with minimal skew.

4. Thermal Management: Given the FPGA's potential to dissipate significant power, effective heat management strategies should be put into place.

5. Signal Integrity: To avoid issues like cross-talk or signal reflections, appropriate PCB layout techniques and termination methods need to be applied.

The XC6SLX150-3FGG484C provides an adaptable and high-performance platform for diverse digital computation needs, delivering a strong feature set fit for a wide range of applications.

XC6SLX150-3FGG484C FAQ

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6. What is the process for return or replacement of XC6SLX150-3FGG484C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX150-3FGG484C we delivered, we will accept the replacement or return of the XC6SLX150-3FGG484C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX150-3FGG484C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations