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Name: XC6SLX150-2FGG900C
Brand: AMD Xilinx
SKU: XC6SLX150-2FGG900C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC6SLX150-2FGG900C

Part No.:: XC6SLX150-2FGG900C

Manufacturer:: AMD Xilinx

Package:: 900-BBGA

Datasheet:: XC6SLX150-2FGG900C.pdf

Description:: IC FPGA 576 I/O 900FBGA

In Stock:: 2873

Quantity:: Add To Cart

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XC6SLX150-2FGG900C Specifications

Package/Case:
900-BBGA
Packaging:
Tray
Series:
Spartan®-6 LX
ProductStatus:
Active
NumberofLABs/CLBs:
11519
NumberofLogicElements/Cells:
147443
TotalRAMBits:
4939776
NumberofI/O:
576
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC6SLX150-2FGG900C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC6SLX150-2FGG900C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC6SLX150-2FGG900C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC6SLX150-2FGG900C information

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XC6SLX150-2FGG900C performance and reliability evaluation in extreme environments

XC6SLX150-2FGG900C is a high-performance field-programmable gate array (FPGA) designed by Xilinx, widely used in applications requiring high processing power and flexibility. Its features include abundant logic cells, versatile IO interfaces, and low power consumption.

Application Scenario:

In aerospace and defense systems, XC6SLX150-2FGG900C plays a critical role in signal processing, radar systems, and communication modules, where high reliability and performance are paramount.

Design Considerations:

When designing systems with XC6SLX150-2FGG900C for extreme environments, such as high temperatures, low temperatures, and high humidity, several factors need to be considered:

1. Thermal Management:

To ensure reliable operation at high temperatures, proper thermal management techniques should be implemented. This includes heatsinking, thermal vias, and airflow optimization to dissipate heat generated during operation.

2. Component Selection:

Selecting components rated for extended temperature ranges is essential for operation in extreme environments. This includes choosing industrial-grade components for capacitors, resistors, and connectors to withstand temperature fluctuations and humidity.

3. Environmental Testing:

Prior to deployment, rigorous environmental testing should be conducted to assess the XC6SLX150-2FGG900C FPGA's performance under extreme conditions. This includes temperature cycling, humidity testing, and thermal shock tests to ensure reliability and longevity.

4. PCB Layout:

Optimizing the PCB layout is crucial for minimizing signal degradation and ensuring reliable operation. Proper grounding, signal routing, and layout considerations, such as avoiding high-speed signal crosstalk and impedance matching, are essential for optimal FPGA performance.

5. Power Supply Design:

Stable power supply design is critical for XC6SLX150-2FGG900C operation in extreme environments. This includes using voltage regulators with wide input voltage ranges, filtering capacitors, and transient voltage suppression to protect against power surges and fluctuations.

Performance Analysis:

In real-world applications, XC6SLX150-2FGG900C demonstrates robust performance and reliability even in harsh environments. Through proper design considerations and testing, it can reliably operate in temperatures ranging from -40°C to 100°C and withstand high humidity levels without compromising performance.

Conclusion:

Overall, XC6SLX150-2FGG900C proves to be a versatile FPGA capable of delivering high performance and reliability in extreme environments when coupled with proper design techniques and testing protocols. Its flexibility and robustness make it a preferred choice for mission-critical applications in aerospace, defense, and industrial sectors.

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6. What is the process for return or replacement of XC6SLX150-2FGG900C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX150-2FGG900C we delivered, we will accept the replacement or return of the XC6SLX150-2FGG900C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX150-2FGG900C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations