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Name: XC5215-6PQ160C
Brand: AMD Xilinx
SKU: XC5215-6PQ160C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XC5215-6PQ160C

Part No.:: XC5215-6PQ160C

Manufacturer:: AMD Xilinx

Package:: -

Datasheet:: XC5215-6PQ160C.pdf

Description:: FPGA, 484 CLBS, 15000 GATES

In Stock:: 2329

Quantity:: Add To Cart

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XC5215-6PQ160C Specifications

Package/Case:
-
Packaging:
Bulk
Series:
*
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
-
TotalRAMBits:
-
NumberofI/O:
-
NumberofGates:
-
Voltage-Supply:
-
MountingType:
-
OperatingTemperature:
-

XC5215-6PQ160C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC5215-6PQ160C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC5215-6PQ160C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC5215-6PQ160C information

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XC5215-6PQ160C performance and reliability evaluation in extreme environments

XC5215-6PQ160C is a high-performance FPGA (Field-Programmable Gate Array) device designed for demanding applications where reliability and performance are critical. Its robust architecture and extensive feature set make it suitable for use in extreme environmental conditions.

Environmental Considerations:

In the design of XC5215-6PQ160C, several environmental factors are carefully considered to ensure reliable operation in harsh conditions:

1. Temperature: The device is designed to operate over a wide temperature range, from -40°C to 125°C. This capability allows it to function reliably in both extreme cold and hot environments, such as automotive, industrial, and aerospace applications.

2. Thermal Management: Special attention is given to thermal management to dissipate heat efficiently, especially in high-temperature environments. Heat sinks and thermal vias are incorporated into the design to prevent overheating and ensure long-term reliability.

3. Humidity: The device is designed to withstand high levels of humidity without compromising performance or reliability. Moisture-resistant packaging and conformal coating help protect the internal components from moisture ingress, ensuring stable operation in humid environments.

4. Shock and Vibration: XC5215-6PQ160C is engineered to withstand mechanical shock and vibration, making it suitable for use in rugged applications such as automotive and industrial control systems. Robust packaging and soldering techniques ensure the integrity of the device under harsh mechanical conditions.

Performance Analysis:

In real-world applications, XC5215-6PQ160C demonstrates exceptional performance and reliability even in the most challenging environments. Here are some key aspects of its performance:

1. High-Speed Processing: The FPGA's high-speed processing capabilities enable rapid data processing and real-time response, making it ideal for applications that require fast computation, such as signal processing and image recognition.

2. Low Power Consumption: Despite its high performance, XC5215-6PQ160C maintains low power consumption, contributing to energy efficiency and prolonged battery life in portable and battery-operated devices.

3. Flexible Configuration: The FPGA's programmable nature allows for flexible configuration and adaptation to changing application requirements. Designers can reprogram the device as needed to accommodate new features or optimize performance.

4. Reliable Operation: Through rigorous testing and validation, XC5215-6PQ160C demonstrates reliable operation under various environmental conditions, ensuring consistent performance and long-term reliability in mission-critical systems.

Conclusion:

XC5215-6PQ160C excels in extreme environmental conditions due to its robust design, thermal management capabilities, and high performance. Whether deployed in automotive, industrial, or aerospace applications, this FPGA device offers unmatched reliability and performance, making it a preferred choice for demanding environments.

XC5215-6PQ160C FAQ

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3. Are the XC5215-6PQ160C price and inventory displayed accurate?

The price and inventory of XC5215-6PQ160C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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5. How is the shipping arranged?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC5215-6PQ160C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC5215-6PQ160C we delivered, we will accept the replacement or return of the XC5215-6PQ160C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC5215-6PQ160C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations