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Name: XC3SD3400A-4FGG676C
Brand: Xilinx Inc.
SKU: XC3SD3400A-4FGG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Xilinx Inc. XC3SD3400A-4FGG676C

Part No.:: XC3SD3400A-4FGG676C

Manufacturer:: Xilinx Inc.

Package:: 676-BGA

Datasheet:: XC3SD3400A-4FGG676C.pdf

Description:: IC FPGA 469 I/O 676FBGA

In Stock:: 2529

Quantity:: Add To Cart

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XC3SD3400A-4FGG676C Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Spartan®-3A DSP
ProductStatus:
Active
NumberofLABs/CLBs:
5968
NumberofLogicElements/Cells:
53712
TotalRAMBits:
2322432
NumberofI/O:
469
NumberofGates:
3400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3SD3400A-4FGG676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3SD3400A-4FGG676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3SD3400A-4FGG676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3SD3400A-4FGG676C information

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XC3SD3400A-4FGG676C Typical application Circuitry

The XC3SD3400A-4FGG676C is an FPGA (Field-Programmable Gate Array) chip from Xilinx's Spartan-3A DSP series. These chips are designed for reconfiguration post-manufacture, allowing for a wide range of digital circuit designs.

XC3SD3400A-4FGG676C Application Scenarios:

With its versatile architecture, the XC3SD3400A-4FGG676C is suitable for multiple applications:

- Digital signal processing (DSP) for audio and video

- Wireless communication systems

- Industrial control and automation

- Embedded systems for consumer electronics

- Data encryption and security

Key Features of XC3SD3400A-4FGG676C:

- Logic cells: Approximately 33,192

- Embedded memory: Adequate

- DSP slices: Significant number

- I/O pins: Up to 376

- Packaging: FGG676 (Fine-pitch Grid Array)

Application Example: Wireless Communication System:

1. Initial Setup: Place the XC3SD3400A-4FGG676C FPGA onto the target circuit board, ensuring all crucial pins are accessible.

2. Power Supply Configuration: Connect the VCC pins of the XC3SD3400A-4FGG676C to the power source (typically 3.3V), and all GND pins should be tied to the system's ground.

3. I/O Pin Designation: Assign specific pins on the XC3SD3400A-4FGG676C for data input from RF modules and output to signal processing units.

4. JTAG Interface for XC3SD3400A-4FGG676C:

- TDI (Test Data In): Connect this to pin 1 for JTAG data input.

- TDO (Test Data Out): Link this to pin 2 for JTAG data output.

- TCK (Test Clock): Associate this with pin 3 to align with the JTAG tool's clock.

- TMS (Test Mode Select): Bind this to pin 4 for JTAG mode selection.

5. Wireless Logic Implementation: Utilize a programming tool like ISE to instill the XC3SD3400A-4FGG676C with the logic required for wireless communication, including modulation, demodulation, and error correction.

6. Clock Synchronization: Ensure the XC3SD3400A-4FGG676C is connected to an external clock source, linked to the FPGA's dedicated clock pin.

7. Peripheral Integration: Interface the XC3SD3400A-4FGG676C with essential components such as RF transceivers, antennas, or memory modules using designated FPGA pins.

Design Considerations for XC3SD3400A-4FGG676C:

1. Stable Power Supply: Maintaining a consistent power supply to the XC3SD3400A-4FGG676C is crucial for optimal performance.

2. Cooling Solutions: Implement appropriate cooling solutions, such as heat sinks or fans, to manage heat generated during operation.

3. Signal Integrity: Ensure signal quality through effective grounding and the strategic placement of decoupling capacitors.

4. Firmware Upgradability: Design the circuit to accommodate future firmware updates or modifications to the XC3SD3400A-4FGG676C.

5. Efficient Layout: Given the packaging of the XC3SD3400A-4FGG676C, careful planning is necessary to optimize component placement and trace routing.

The XC3SD3400A-4FGG676C, as part of Xilinx's Spartan-3A DSP series, is a testament to the adaptability of FPGAs. Its application in wireless communication systems is just one illustration of its capabilities. With thoughtful design and implementation, this FPGA can be harnessed to develop innovative solutions across various industries.

XC3SD3400A-4FGG676C FAQ

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6. What is the process for return or replacement of XC3SD3400A-4FGG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3SD3400A-4FGG676C we delivered, we will accept the replacement or return of the XC3SD3400A-4FGG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3SD3400A-4FGG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations