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Name: XC3S700A-5FTG256C
Brand: AMD Xilinx
SKU: XC3S700A-5FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S700A-5FTG256C

Part No.:: XC3S700A-5FTG256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XC3S700A-5FTG256C.pdf

Description:: IC FPGA 161 I/O 256FTBGA

In Stock:: 2174

Quantity:: Add To Cart

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XC3S700A-5FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Spartan®-3A
ProductStatus:
Active
NumberofLABs/CLBs:
1472
NumberofLogicElements/Cells:
13248
TotalRAMBits:
368640
NumberofI/O:
161
NumberofGates:
700000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S700A-5FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S700A-5FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S700A-5FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S700A-5FTG256C information

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XC3S700A-5FTG256C application case analysis in emerging technology fields

XC3S700A-5FTG256C is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx, offering versatile functionality and flexibility for various applications. It features a large number of programmable logic cells, embedded memory blocks, and high-speed I/O interfaces.

Application Scenario:

In the field of digital signal processing (DSP), XC3S700A-5FTG256C can be utilized to implement complex algorithms for audio processing in multimedia applications.

Algorithm Implementation:

To achieve efficient audio processing using XC3S700A-5FTG256C, consider the following steps:

1. Audio Input:

Acquire audio signals from external sources, such as microphones or audio interfaces, and interface them with the FPGA. Utilize the high-speed I/O interfaces of XC3S700A-5FTG256C for signal acquisition.

2. Signal Processing:

Implement digital signal processing algorithms, such as filtering, equalization, and modulation, using the programmable logic cells and embedded DSP slices of XC3S700A-5FTG256C. Optimize algorithms for parallel processing to maximize efficiency.

3. Audio Output:

Generate processed audio signals and drive output devices, such as speakers or audio interfaces, using the FPGA's high-speed I/O interfaces. Ensure proper buffering and signal conditioning for high-quality audio output.

4. User Interface:

Integrate user interface elements, such as LCD displays or touch panels, for user interaction and control. Utilize the FPGA's GPIO pins for interfacing with user input devices and displaying relevant information.

5. Real-Time Processing:

Implement real-time processing capabilities to handle audio signals with low latency and high throughput. Utilize the inherent parallelism of XC3S700A-5FTG256C to achieve real-time performance.

Considerations:

When designing the audio processing system, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to accommodate complex algorithms while meeting performance requirements.

- Clocking and Timing: Pay attention to clocking and timing constraints to ensure synchronous operation and avoid signal integrity issues.

- Power Consumption: Implement power-efficient design techniques to minimize power consumption and prolong battery life in portable audio devices.

- Algorithm Complexity: Balance algorithm complexity with FPGA resources and performance constraints to achieve the desired audio processing functionality.

- System Integration: Integrate the FPGA-based audio processing system with other components, such as microcontrollers or digital audio interfaces, for seamless operation and compatibility.

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6. What is the process for return or replacement of XC3S700A-5FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S700A-5FTG256C we delivered, we will accept the replacement or return of the XC3S700A-5FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S700A-5FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations