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Name: XC3S700A-5FGG400C
Brand: AMD Xilinx
SKU: XC3S700A-5FGG400C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S700A-5FGG400C

Part No.:: XC3S700A-5FGG400C

Manufacturer:: AMD Xilinx

Package:: 400-BGA

Datasheet:: XC3S700A-5FGG400C.pdf

Description:: IC FPGA 311 I/O 400FBGA

In Stock:: 2537

Quantity:: Add To Cart

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XC3S700A-5FGG400C Specifications

Package/Case:
400-BGA
Packaging:
Tray
Series:
Spartan®-3A
ProductStatus:
Active
NumberofLABs/CLBs:
1472
NumberofLogicElements/Cells:
13248
TotalRAMBits:
368640
NumberofI/O:
311
NumberofGates:
700000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S700A-5FGG400C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S700A-5FGG400C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S700A-5FGG400C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S700A-5FGG400C information

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XC3S700A-5FGG400C application case analysis in emerging technology fields

XC3S700A-5FGG400C is a FPGA (Field-Programmable Gate Array) device manufactured by Xilinx, offering high performance and flexibility for various applications. It features a large number of programmable logic cells, abundant memory resources, and versatile I/O capabilities.

Application Scenario:

In telecommunications infrastructure, XC3S700A-5FGG400C can be utilized to implement signal processing algorithms for high-speed data transmission and reception, enabling efficient communication networks.

System Architecture:

To design a high-speed data processing system using XC3S700A-5FGG400C, consider the following architecture:

1. Signal Processing Pipeline:

Implement a pipeline architecture using the FPGA's parallel processing capabilities to efficiently process incoming data streams. Utilize the programmable logic resources to perform tasks such as filtering, modulation/demodulation, and error correction.

2. Interface Integration:

Integrate high-speed interface modules, such as PCIe (Peripheral Component Interconnect Express) or Ethernet MAC (Media Access Control), to interface with external devices or network infrastructure. Utilize the FPGA's configurable I/O pins to connect to these interfaces.

3. Memory Management:

Utilize the embedded block RAM and distributed RAM resources within XC3S700A-5FGG400C to buffer and store intermediate data during processing. Implement efficient memory access schemes to minimize latency and maximize throughput.

4. Real-Time Control:

Implement real-time control logic using the FPGA's programmable fabric to dynamically adjust processing parameters based on system requirements or external stimuli. Utilize techniques such as state machines or microcontroller cores for responsive control.

5. Power Optimization:

Optimize the FPGA design for power efficiency by leveraging clock gating, power gating, and dynamic voltage scaling techniques. Implement power management modules within the FPGA fabric to dynamically adjust power consumption based on workload.

Considerations:

When designing with XC3S700A-5FGG400C, it's important to consider:

- Resource Utilization: Efficiently utilize the FPGA's programmable logic, memory, and I/O resources to meet performance targets while minimizing resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met, especially in high-speed data processing applications.

- Design Flexibility: Take advantage of the FPGA's reconfigurability to adapt the design to evolving requirements or to accommodate future updates and enhancements.

- Verification and Testing: Rigorously verify the FPGA design through simulation, emulation, and prototyping to ensure functional correctness and reliability under various operating conditions.

- Security Considerations: Implement security features such as bitstream encryption and authentication to protect the FPGA configuration from unauthorized access or tampering.

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6. What is the process for return or replacement of XC3S700A-5FGG400C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S700A-5FGG400C we delivered, we will accept the replacement or return of the XC3S700A-5FGG400C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S700A-5FGG400C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations