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Name: XC3S50AN-5TQG144C
Brand: AMD Xilinx
SKU: XC3S50AN-5TQG144C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S50AN-5TQG144C

Part No.:: XC3S50AN-5TQG144C

Manufacturer:: AMD Xilinx

Package:: 144-LQFP

Datasheet:: XC3S50AN-5TQG144C.pdf

Description:: IC FPGA 108 I/O 144TQFP

In Stock:: 3699

Quantity:: Add To Cart

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XC3S50AN-5TQG144C Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
Spartan®-3AN
ProductStatus:
Active
NumberofLABs/CLBs:
176
NumberofLogicElements/Cells:
1584
TotalRAMBits:
55296
NumberofI/O:
108
NumberofGates:
50000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S50AN-5TQG144C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S50AN-5TQG144C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S50AN-5TQG144C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S50AN-5TQG144C information

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XC3S50AN-5TQG144C performance and reliability evaluation in extreme environments

XC3S50AN-5TQG144C is a field-programmable gate array (FPGA) chip known for its versatility and reliability, commonly used in a wide range of applications, from aerospace to industrial automation. Its robust performance makes it suitable for deployment in extreme environmental conditions.

Design Considerations:

When designing systems with XC3S50AN-5TQG144C for extreme environments, several factors must be taken into account:

1. Temperature: The FPGA must be capable of operating reliably across a wide temperature range. Thermal management techniques such as heat sinks, fans, or specialized enclosures may be necessary to ensure proper cooling in high-temperature environments and prevent thermal runaway. Conversely, in low-temperature environments, measures such as thermal insulation or heaters may be required to maintain operational temperatures.

2. Humidity: Moisture can adversely affect the performance of electronic components, leading to corrosion or short circuits. Proper sealing and conformal coating of the PCB hosting XC3S50AN-5TQG144C can help mitigate the effects of humidity. Additionally, using moisture-resistant materials and designing adequate ventilation can prevent moisture buildup within the enclosure.

3. Vibration and Shock: In applications subject to vibration or mechanical shock, such as automotive or aerospace systems, the mounting and securing of the FPGA and associated components must be carefully designed to withstand these forces. Shock-absorbing mounts, ruggedized enclosures, and conformal coating can help enhance the resilience of the system.

4. Radiation: For applications in space or nuclear environments, radiation hardening is crucial to protect the FPGA from ionizing radiation effects such as single-event upsets (SEUs) and total ionizing dose (TID) effects. Radiation-tolerant materials and design techniques, as well as error detection and correction (EDAC) mechanisms, are employed to ensure reliable operation.

Performance in Practice:

In real-world applications, XC3S50AN-5TQG144C has demonstrated exceptional performance and reliability even in the harshest environments. For example, in satellite communication systems, where it is exposed to extreme temperatures, vacuum conditions, and radiation, the FPGA has consistently delivered reliable operation, facilitating critical functions such as signal processing and data routing.

In automotive electronics, XC3S50AN-5TQG144C has been utilized for engine control, driver assistance systems, and infotainment, withstanding temperature variations, vibration, and electrical noise without compromising performance or safety.

Similarly, in industrial automation, where equipment may be exposed to temperature extremes, humidity, and mechanical stress, XC3S50AN-5TQG144C has proven to be a dependable choice for control and monitoring applications, ensuring smooth operation even in challenging environments.

Conclusion:

With careful consideration of environmental factors and appropriate design measures, XC3S50AN-5TQG144C can reliably operate in extreme conditions, making it an ideal choice for mission-critical applications across various industries.

XC3S50AN-5TQG144C FAQ

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6. What is the process for return or replacement of XC3S50AN-5TQG144C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S50AN-5TQG144C we delivered, we will accept the replacement or return of the XC3S50AN-5TQG144C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S50AN-5TQG144C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations