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Name: XC3S5000-4FGG1156C
Brand: AMD Xilinx
SKU: XC3S5000-4FGG1156C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S5000-4FGG1156C

Part No.:: XC3S5000-4FGG1156C

Manufacturer:: AMD Xilinx

Package:: -

Datasheet:: XC3S5000-4FGG1156C.pdf

Description:: FPGA, 8320 CLBS, 5000000 GATES

In Stock:: 429

Quantity:: Add To Cart

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XC3S5000-4FGG1156C Specifications

Package/Case:
-
Packaging:
Bulk
Series:
Spartan®-3
ProductStatus:
Active
NumberofLABs/CLBs:
8320
NumberofLogicElements/Cells:
74880
TotalRAMBits:
1916928
NumberofI/O:
633
NumberofGates:
5000000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-

XC3S5000-4FGG1156C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S5000-4FGG1156C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S5000-4FGG1156C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S5000-4FGG1156C information

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XC3S5000-4FGG1156C performance and reliability evaluation in extreme environments

XC3S5000-4FGG1156C is a field-programmable gate array (FPGA) chip known for its high performance and versatility, commonly utilized in various applications ranging from telecommunications to aerospace systems. It features a large number of logic cells, abundant memory resources, and flexible I/O capabilities.

Environmental Considerations:

When designing with XC3S5000-4FGG1156C for extreme environments, such as those with high temperatures, low temperatures, or high humidity, several factors need to be considered to ensure reliable operation.

1. Temperature: XC3S5000-4FGG1156C is designed to operate within a specified temperature range. For high-temperature environments, proper heat dissipation mechanisms, such as heat sinks or fans, should be incorporated to prevent overheating and ensure stable performance. Similarly, for low-temperature environments, the FPGA's operational characteristics at lower temperatures should be evaluated to guarantee functionality.

2. Humidity: High humidity can lead to moisture ingress, potentially causing short circuits or corrosion on the FPGA's surface. Conformal coating or encapsulation can be applied to protect the XC3S5000-4FGG1156C from moisture and ensure long-term reliability.

3. Mechanical Stress: In harsh environments, mechanical stress due to vibration or shock can impact the integrity of solder joints and connections on the FPGA. Adequate mechanical support and shock-absorbing measures should be implemented to mitigate these effects and prevent damage to the device.

Performance in Practical Applications:

In practical applications, XC3S5000-4FGG1156C demonstrates robust performance and reliability, even in extreme environmental conditions. For example, in aerospace systems where temperature variations are significant, the FPGA's ability to withstand wide temperature ranges while maintaining precise functionality is crucial for mission success.

In telecommunications infrastructure deployed in remote or harsh environments, XC3S5000-4FGG1156C plays a vital role in processing and routing data reliably, despite fluctuations in temperature and humidity.

Moreover, in industrial automation applications where ruggedness and durability are paramount, XC3S5000-4FGG1156C offers the flexibility and performance required to adapt to changing environmental conditions while ensuring uninterrupted operation.

Conclusion:

Overall, the XC3S5000-4FGG1156C FPGA exhibits exceptional performance and reliability in extreme environments when proper design considerations and mitigation strategies are implemented. Its versatility and robustness make it a preferred choice for applications demanding high performance and resilience in challenging operating conditions.

XC3S5000-4FGG1156C FAQ

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6. What is the process for return or replacement of XC3S5000-4FGG1156C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S5000-4FGG1156C we delivered, we will accept the replacement or return of the XC3S5000-4FGG1156C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S5000-4FGG1156C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations