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Name: XC3S5000-4FG1156C
Brand: AMD Xilinx
SKU: XC3S5000-4FG1156C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S5000-4FG1156C

Part No.:: XC3S5000-4FG1156C

Manufacturer:: AMD Xilinx

Package:: -

Datasheet:: XC3S5000-4FG1156C.pdf

Description:: FPGA, 8320 CLBS, 5000000 GATES

In Stock:: 3725

Quantity:: Add To Cart

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XC3S5000-4FG1156C Specifications

Package/Case:
-
Packaging:
Bulk
Series:
Spartan®-3
ProductStatus:
Active
NumberofLABs/CLBs:
8320
NumberofLogicElements/Cells:
74880
TotalRAMBits:
-
NumberofI/O:
489
NumberofGates:
5000000
Voltage-Supply:
-
MountingType:
Surface Mount
OperatingTemperature:
-

XC3S5000-4FG1156C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S5000-4FG1156C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S5000-4FG1156C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S5000-4FG1156C information

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XC3S5000-4FG1156C performance and reliability evaluation in extreme environments

XC3S5000-4FG1156C is a high-capacity FPGA (Field-Programmable Gate Array) manufactured by Xilinx, known for its versatility and performance in demanding applications. This article explores its behavior and reliability assessment in extreme environmental conditions, such as high temperatures, low temperatures, and humidity, while also delving into the design considerations for these environments.

Environmental Considerations:

In designing with XC3S5000-4FG1156C, environmental factors play a critical role in ensuring reliable operation. Here's how these factors are considered:

1. Thermal Management:

XC3S5000-4FG1156C is designed to withstand a wide range of temperatures, but proper thermal management is crucial to prevent overheating, especially in high-temperature environments. Adequate heat sinking and airflow design should be implemented to dissipate heat effectively.

2. Temperature Compensation:

For applications exposed to extreme temperatures, temperature compensation techniques can be employed within the FPGA design to ensure stable performance across temperature variations. This may involve calibrating internal parameters or employing temperature sensors for feedback control.

3. Humidity Protection:

Although XC3S5000-4FG1156C is designed to operate in a variety of environments, exposure to high humidity levels can potentially lead to moisture-related issues. Proper conformal coating and sealing techniques should be utilized to protect the FPGA and surrounding components from moisture ingress.

Performance Analysis:

In practical applications, XC3S5000-4FG1156C demonstrates robust performance across a spectrum of environmental conditions. Here's a brief analysis:

1. High-Temperature Operation:

Even under elevated temperatures, XC3S5000-4FG1156C maintains stable functionality, thanks to its rugged design and thermal management features. Proper heat dissipation techniques ensure reliable operation without compromising performance.

2. Low-Temperature Operation:

In cold environments, XC3S5000-4FG1156C continues to function reliably, although extreme cold may affect response times and speed. However, careful design considerations can mitigate any potential performance degradation in low-temperature settings.

3. Humidity Resistance:

Through effective humidity protection measures, XC3S5000-4FG1156C remains resilient to moisture-related issues, ensuring consistent performance even in humid conditions.

Conclusion:

XC3S5000-4FG1156C exhibits exceptional performance and reliability in extreme environmental conditions when integrated into well-designed systems. By considering factors such as thermal management, temperature compensation, and humidity protection, engineers can leverage the full potential of this FPGA across a wide range of applications.

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6. What is the process for return or replacement of XC3S5000-4FG1156C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S5000-4FG1156C we delivered, we will accept the replacement or return of the XC3S5000-4FG1156C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S5000-4FG1156C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations