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Name: XC3S400A-4FGG320C
Brand: AMD Xilinx
SKU: XC3S400A-4FGG320C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S400A-4FGG320C

Part No.:: XC3S400A-4FGG320C

Manufacturer:: AMD Xilinx

Package:: 320-BGA

Datasheet:: XC3S400A-4FGG320C.pdf

Description:: IC FPGA 251 I/O 320FBGA

In Stock:: 3761

Quantity:: Add To Cart

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XC3S400A-4FGG320C Specifications

Package/Case:
320-BGA
Packaging:
Tray
Series:
Spartan®-3A
ProductStatus:
Active
NumberofLABs/CLBs:
896
NumberofLogicElements/Cells:
8064
TotalRAMBits:
368640
NumberofI/O:
251
NumberofGates:
400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S400A-4FGG320C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S400A-4FGG320C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S400A-4FGG320C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S400A-4FGG320C information

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XC3S400A-4FGG320C performance and reliability evaluation in extreme environments

XC3S400A-4FGG320C is a field-programmable gate array (FPGA) chip renowned for its versatility and performance, commonly utilized in a myriad of industrial and commercial applications. It boasts a large number of logic cells, abundant routing resources, and high-speed I/O interfaces, making it suitable for demanding tasks in various domains.

Environmental Considerations:

In the design process of systems incorporating XC3S400A-4FGG320C, environmental factors such as temperature, humidity, and radiation need meticulous attention to ensure reliable operation in extreme conditions.

1. Temperature:

To address temperature extremes, the design should incorporate thermal management techniques such as heat sinks, fans, or even specialized enclosures for heat dissipation. Additionally, the FPGA's datasheet provides temperature ratings and guidelines for operation within specified temperature ranges.

2. Humidity:

High humidity environments can pose challenges to electronic components, including FPGAs. Conformal coating and sealed enclosures can mitigate the effects of moisture ingress, preserving the integrity of the XC3S400A-4FGG320C chip and associated circuitry.

3. Radiation:

In radiation-prone environments, such as aerospace or nuclear applications, radiation-hardened FPGA variants may be preferred. Alternatively, shielding and error-detection/correction techniques can enhance the resilience of standard XC3S400A-4FGG320C devices against radiation-induced errors.

Performance in Practical Applications:

Despite the challenges posed by extreme environments, XC3S400A-4FGG320C demonstrates robust performance across various real-world applications.

1. Aerospace:

In aerospace applications, where temperature differentials and radiation are significant concerns, XC3S400A-4FGG320C has proven its mettle in mission-critical tasks such as onboard data processing, communication, and control systems.

2. Automotive:

Automotive electronics demand reliability under harsh conditions, including temperature variations and mechanical stress. XC3S400A-4FGG320C facilitates the development of advanced driver assistance systems (ADAS), engine control units (ECUs), and infotainment systems with its performance and robustness.

3. Industrial Automation:

In industrial automation, where environmental conditions can be unpredictable, XC3S400A-4FGG320C plays a pivotal role in implementing flexible and adaptive control systems for manufacturing processes, robotics, and machine vision applications.

Conclusion:

XC3S400A-4FGG320C stands as a testament to FPGA technology's resilience and adaptability, providing designers with a versatile platform to address the challenges of extreme environments while delivering reliable performance in diverse applications.

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6. What is the process for return or replacement of XC3S400A-4FGG320C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S400A-4FGG320C we delivered, we will accept the replacement or return of the XC3S400A-4FGG320C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S400A-4FGG320C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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