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Name: XC3S400-5FG456C
Brand: AMD Xilinx
SKU: XC3S400-5FG456C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S400-5FG456C

Part No.:: XC3S400-5FG456C

Manufacturer:: AMD Xilinx

Package:: 456-BBGA

Datasheet:: XC3S400-5FG456C.pdf

Description:: IC FPGA 264 I/O 456FBGA

In Stock:: 3907

Quantity:: Add To Cart

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XC3S400-5FG456C Specifications

Package/Case:
456-BBGA
Packaging:
Bulk
Series:
Spartan®-3
ProductStatus:
Active
NumberofLABs/CLBs:
896
NumberofLogicElements/Cells:
8064
TotalRAMBits:
294912
NumberofI/O:
264
NumberofGates:
400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S400-5FG456C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S400-5FG456C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S400-5FG456C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S400-5FG456C information

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XC3S400-5FG456C application case analysis in emerging technology fields

XC3S400-5FG456C is a field-programmable gate array (FPGA) manufactured by Xilinx, known for its versatility and high-performance capabilities. It features a large number of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM resources, making it suitable for a wide range of applications.

Application Scenario:

In telecommunications infrastructure, XC3S400-5FG456C can be utilized to implement efficient and intelligent baseband processing functionalities, such as channel coding and modulation/demodulation schemes in wireless communication systems.

System Architecture:

To design a baseband processing system using XC3S400-5FG456C, consider the following components and functionalities:

1. Baseband Processing Blocks:

Utilize the CLBs and DSP slices of XC3S400-5FG456C to implement digital signal processing algorithms for tasks like error correction coding, interleaving, and modulation schemes such as QPSK or OFDM.

2. Memory Interface:

Interfacing with external memory components, such as DDR SDRAM or Flash memory, is essential for storing and accessing data efficiently. Configure the block RAM resources of XC3S400-5FG456C to buffer and process data streams effectively.

3. Peripheral Interfaces:

Integrate peripheral interfaces like UART, SPI, or Ethernet to facilitate communication with other system components, such as RF transceivers or network interfaces. Configure the I/O pins of XC3S400-5FG456C for seamless data exchange.

4. Real-Time Processing:

Implement real-time processing algorithms to handle incoming data streams efficiently. Utilize the parallel processing capabilities of XC3S400-5FG456C to achieve high throughput and low latency performance.

5. Power Management:

Ensure efficient power management techniques, such as dynamic voltage and frequency scaling (DVFS), to optimize power consumption without compromising performance. Utilize the power gating features of XC3S400-5FG456C to selectively power down unused resources.

Considerations:

When designing the baseband processing system, it's essential to consider:

- Resource Utilization: Optimize the utilization of CLBs, DSP slices, and block RAM resources to maximize the system's processing capabilities.

- Timing Closure: Ensure timing constraints are met during synthesis and place-and-route stages to guarantee reliable operation at the target clock frequency.

- Signal Integrity: Design the PCB layout carefully to minimize signal reflections and crosstalk, especially in high-speed interfaces like DDR SDRAM or Ethernet.

- System Scalability: Design the system with scalability in mind to accommodate future upgrades or enhancements, such as adding more processing cores or expanding memory capacity.

- Thermal Management: Implement thermal management techniques, such as heat sinks or fans, to prevent overheating and ensure reliable operation over extended periods.

XC3S400-5FG456C FAQ

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3. Are the XC3S400-5FG456C price and inventory displayed accurate?

The price and inventory of XC3S400-5FG456C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC3S400-5FG456C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S400-5FG456C we delivered, we will accept the replacement or return of the XC3S400-5FG456C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S400-5FG456C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations