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Name: XC3S400-4FT256C
Brand: AMD Xilinx
SKU: XC3S400-4FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S400-4FT256C

Part No.:: XC3S400-4FT256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XC3S400-4FT256C.pdf

Description:: IC FPGA 173 I/O 256FTBGA

In Stock:: 3638

Quantity:: Add To Cart

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XC3S400-4FT256C Specifications

Package/Case:
256-LBGA
Packaging:
Bulk
Series:
Spartan®-3
ProductStatus:
Active
NumberofLABs/CLBs:
896
NumberofLogicElements/Cells:
8064
TotalRAMBits:
294912
NumberofI/O:
173
NumberofGates:
400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S400-4FT256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S400-4FT256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S400-4FT256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S400-4FT256C information

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XC3S400-4FT256C application case analysis in emerging technology fields

XC3S400-4FT256C is a FPGA (Field Programmable Gate Array) chip manufactured by Xilinx, featuring high flexibility and programmability for a wide range of applications. It offers abundant logic resources, embedded memory blocks, and versatile I/O options.

Application Scenario:

In the domain of digital signal processing (DSP), XC3S400-4FT256C can be utilized to implement efficient algorithms for tasks such as audio and video processing, wireless communication, and radar signal processing.

Circuit Design:

To leverage the capabilities of XC3S400-4FT256C for DSP applications, consider the following design steps:

1. Algorithm Implementation:

Develop DSP algorithms, such as filters, transforms, and modulation/demodulation schemes, using hardware description languages (HDLs) like Verilog or VHDL. Utilize the abundant logic resources and embedded DSP blocks within XC3S400-4FT256C for efficient algorithm execution.

2. Interface Design:

Design interfaces to connect XC3S400-4FT256C with external components, such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), for signal acquisition and generation. Utilize the flexible I/O options of XC3S400-4FT256C to accommodate different data formats and sampling rates.

3. Real-Time Processing:

Implement real-time processing pipelines within XC3S400-4FT256C to handle streaming data efficiently. Utilize the chip's high-speed serial interfaces, such as Gigabit Ethernet or PCIe, for high-throughput data transfer between the FPGA and external systems.

4. System Integration:

Integrate XC3S400-4FT256C into larger system architectures, incorporating other processing elements like microcontrollers or application-specific integrated circuits (ASICs). Utilize communication protocols such as SPI or I2C for seamless interaction between different components.

5. Power Optimization:

Implement power-saving techniques within the FPGA design to minimize energy consumption while maintaining performance. Utilize clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) techniques to achieve efficient power management.

Considerations:

When designing DSP systems with XC3S400-4FT256C, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic cells, memory blocks, and I/O interfaces, to achieve maximum performance and efficiency.

- Timing Closure: Ensure that timing constraints are met to guarantee proper operation of the DSP algorithms and interfaces, avoiding issues such as setup and hold time violations.

- Signal Integrity: Pay attention to signal integrity considerations, such as signal routing, termination, and impedance matching, to maintain signal integrity and minimize noise in high-speed data paths.

- Scalability: Design the DSP system with scalability in mind, allowing for future expansion and adaptation to evolving application requirements without significant redesign effort.

- Verification and Testing: Thoroughly verify the FPGA design using simulation and hardware testing techniques to ensure correctness, robustness, and compliance with specifications.

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6. What is the process for return or replacement of XC3S400-4FT256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S400-4FT256C we delivered, we will accept the replacement or return of the XC3S400-4FT256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S400-4FT256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations