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Name: XC3S200AN-4FT256C
Brand: AMD Xilinx
SKU: XC3S200AN-4FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S200AN-4FT256C

Part No.:: XC3S200AN-4FT256C

Manufacturer:: AMD Xilinx

Package:: 256-LBGA

Datasheet:: XC3S200AN-4FT256C.pdf

Description:: IC FPGA 195 I/O 256FTBGA

In Stock:: 3626

Quantity:: Add To Cart

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XC3S200AN-4FT256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
Spartan®-3AN
ProductStatus:
Active
NumberofLABs/CLBs:
448
NumberofLogicElements/Cells:
4032
TotalRAMBits:
294912
NumberofI/O:
195
NumberofGates:
200000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S200AN-4FT256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S200AN-4FT256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S200AN-4FT256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S200AN-4FT256C information

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XC3S200AN-4FT256C application case analysis in emerging technology fields

XC3S200AN-4FT256C is a field-programmable gate array (FPGA) device manufactured by Xilinx, offering high performance and flexibility for various digital logic applications. It features a large number of configurable logic blocks (CLBs), memory blocks, and versatile I/O resources.

Application Scenario:

In the field of telecommunications, XC3S200AN-4FT256C can be utilized to implement advanced signal processing algorithms for wireless communication systems, such as those used in 5G networks.

Circuit Design:

To design a high-performance signal processing system using XC3S200AN-4FT256C, follow these steps:

1. Algorithm Implementation:

Develop signal processing algorithms, such as digital filters or modulation/demodulation schemes, using hardware description languages (HDLs) like Verilog or VHDL. These algorithms will be synthesized and implemented within the XC3S200AN-4FT256C FPGA fabric.

2. I/O Configuration:

Configure the I/O pins of XC3S200AN-4FT256C to interface with external components, such as antennas or baseband processing units. Utilize differential signaling or high-speed serial interfaces for efficient data transfer.

3. Memory Utilization:

Optimize the utilization of memory resources within XC3S200AN-4FT256C for storing intermediate data, coefficients, or lookup tables required by the signal processing algorithms. Utilize block RAMs or distributed memory resources based on the specific application requirements.

4. Clock Management:

Implement clock distribution networks and phase-locked loops (PLLs) within XC3S200AN-4FT256C to generate stable clock signals for synchronous operation of the digital logic. Utilize dedicated clocking resources to meet timing constraints and ensure reliable system performance.

5. Power Optimization:

Implement power management strategies within the FPGA design to minimize power consumption while maintaining performance levels. Utilize dynamic power gating techniques or voltage scaling to reduce power dissipation during idle or low activity periods.

Considerations:

When designing the system, it's essential to consider:

- Resource Utilization: Efficiently utilize the available logic, memory, and I/O resources within XC3S200AN-4FT256C to maximize system performance and minimize resource wastage.

- Signal Integrity: Ensure proper signal integrity by optimizing PCB layout, impedance matching, and minimizing signal reflections for high-speed data interfaces.

- Timing Closure: Perform thorough timing analysis and optimization to meet critical timing constraints and ensure reliable operation of the signal processing algorithms.

- Design Verification: Verify the functionality and performance of the FPGA design through simulation, emulation, and hardware testing to ensure it meets the desired specifications and requirements.

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3. Are the XC3S200AN-4FT256C price and inventory displayed accurate?

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6. What is the process for return or replacement of XC3S200AN-4FT256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S200AN-4FT256C we delivered, we will accept the replacement or return of the XC3S200AN-4FT256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S200AN-4FT256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations