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Name: XC3S200A-4FGG320C
Brand: AMD Xilinx
SKU: XC3S200A-4FGG320C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S200A-4FGG320C

Part No.:: XC3S200A-4FGG320C

Manufacturer:: AMD Xilinx

Package:: 320-BGA

Datasheet:: XC3S200A-4FGG320C.pdf

Description:: IC FPGA 248 I/O 320FBGA

In Stock:: 2623

Quantity:: Add To Cart

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XC3S200A-4FGG320C Specifications

Package/Case:
320-BGA
Packaging:
Tray
Series:
Spartan®-3A
ProductStatus:
Active
NumberofLABs/CLBs:
448
NumberofLogicElements/Cells:
4032
TotalRAMBits:
294912
NumberofI/O:
248
NumberofGates:
200000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S200A-4FGG320C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S200A-4FGG320C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S200A-4FGG320C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S200A-4FGG320C information

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XC3S200A-4FGG320C performance and reliability evaluation in extreme environments

XC3S200A-4FGG320C is a field-programmable gate array (FPGA) manufactured by Xilinx, known for its versatility and performance in a wide range of applications. In extreme environmental conditions, such as high temperature, low temperature, and humidity, assessing its performance and reliability becomes crucial for ensuring uninterrupted operation.

Environmental Considerations:

When designing systems incorporating XC3S200A-4FGG320C, several environmental factors must be taken into account:

- High Temperature: The FPGA's operation may be affected by high temperatures, leading to thermal stress and potential degradation of performance. Heat dissipation mechanisms and thermal management techniques, such as heat sinks and fans, should be employed to maintain optimal operating temperatures.

- Low Temperature: Extreme cold can impact the functionality of electronic components, including FPGAs. Proper insulation and heating systems may be required to prevent performance issues and ensure reliable operation in cold environments.

- Humidity: Excessive humidity can cause moisture ingress, leading to corrosion and short circuits in electronic devices like FPGAs. Encapsulation techniques, conformal coatings, and humidity control measures should be implemented to mitigate the effects of moisture.

Performance Analysis:

In practical applications, XC3S200A-4FGG320C has demonstrated robust performance across various scenarios:

- Embedded Systems: In embedded systems, the FPGA's reconfigurability and parallel processing capabilities enable efficient implementation of complex algorithms and signal processing tasks. Whether deployed in aerospace, automotive, or industrial applications, the FPGA reliably handles diverse tasks with minimal latency.

- Communication Infrastructure: Within communication networks, XC3S200A-4FGG320C plays a vital role in data routing, protocol conversion, and signal modulation. Its low power consumption and high-speed interfaces ensure seamless data transmission, even in demanding environments.

- Medical Devices: In medical devices like imaging systems and patient monitoring equipment, the FPGA's real-time processing capabilities and flexibility facilitate accurate data analysis and rapid decision-making. Its reliability is paramount in critical healthcare applications where downtime is not an option.

- Automotive Electronics: Within automotive electronics, FPGAs like XC3S200A-4FGG320C enable advanced driver assistance systems (ADAS), vehicle-to-everything (V2X) communication, and autonomous driving functionalities. Their resilience to environmental stressors ensures consistent performance in challenging driving conditions.

- Industrial Automation: In industrial automation, FPGAs serve as the backbone of control systems, supervisory control and data acquisition (SCADA) systems, and robotic applications. The FPGA's reliability and adaptability contribute to enhanced productivity and operational efficiency in manufacturing environments.

Conclusion:

XC3S200A-4FGG320C exemplifies Xilinx's commitment to delivering high-performance FPGA solutions capable of withstanding extreme environmental conditions. By addressing environmental factors in the design phase and leveraging its versatile capabilities, engineers can confidently deploy XC3S200A-4FGG320C in diverse applications, ensuring reliability and performance under challenging circumstances.

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6. What is the process for return or replacement of XC3S200A-4FGG320C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S200A-4FGG320C we delivered, we will accept the replacement or return of the XC3S200A-4FGG320C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S200A-4FGG320C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations