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Name: XC3S200-5TQG144C
Brand: AMD Xilinx
SKU: XC3S200-5TQG144C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S200-5TQG144C

Part No.:: XC3S200-5TQG144C

Manufacturer:: AMD Xilinx

Package:: 144-LQFP

Datasheet:: XC3S200-5TQG144C.pdf

Description:: IC FPGA 97 I/O 144TQFP

In Stock:: 3678

Quantity:: Add To Cart

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XC3S200-5TQG144C Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
Spartan®-3
ProductStatus:
Active
NumberofLABs/CLBs:
480
NumberofLogicElements/Cells:
4320
TotalRAMBits:
221184
NumberofI/O:
97
NumberofGates:
200000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC3S200-5TQG144C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S200-5TQG144C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S200-5TQG144C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S200-5TQG144C information

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XC3S200-5TQG144C application case analysis in emerging technology fields

XC3S200-5TQG144C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, offering versatile capabilities for hardware acceleration and digital signal processing applications.

Application Scenario:

In the realm of telecommunications, XC3S200-5TQG144C can be instrumental in implementing efficient and intelligent solutions, such as signal processing algorithms for improved data transmission and reception.

Circuit Design:

To leverage the capabilities of XC3S200-5TQG144C effectively, the following design considerations are paramount:

1. FPGA Configuration:

Utilize the programmable features of XC3S200-5TQG144C to configure custom logic circuits tailored to the specific requirements of the telecommunications application, such as modulation/demodulation, error correction, and channel coding.

2. Parallel Processing:

Exploit the parallel processing capabilities of XC3S200-5TQG144C to handle multiple data streams concurrently, thereby enhancing throughput and reducing latency in communication systems.

3. DSP Functionality:

Integrate digital signal processing (DSP) modules within the FPGA fabric to implement complex signal processing algorithms, such as filtering, equalization, and frequency domain analysis, for optimized signal quality and spectral efficiency.

4. Interface Compatibility:

Ensure compatibility with industry-standard communication interfaces, such as Ethernet, PCIe, or serial protocols, by incorporating appropriate IP cores and interfacing logic into the FPGA design, facilitating seamless integration with existing telecommunications infrastructure.

5. Power Efficiency:

Implement power-efficient design techniques, such as clock gating, dynamic voltage scaling, and partial reconfiguration, to minimize power consumption while maintaining high-performance operation, ensuring sustainability and cost-effectiveness in telecommunications applications.

Considerations:

When designing with XC3S200-5TQG144C, it's essential to consider the following aspects:

- Resource Utilization: Optimize FPGA resource utilization to maximize functionality and minimize resource conflicts, ensuring efficient use of available hardware resources.

- Timing Constraints: Meet timing requirements by carefully balancing design constraints, such as clock frequency, propagation delays, and setup/hold times, to achieve reliable operation within specified performance parameters.

- Design Verification: Thoroughly verify the FPGA design through simulation, emulation, and prototyping to identify and rectify potential design flaws or functional errors before deployment, ensuring robustness and reliability in telecommunications systems.

- Scalability: Design the FPGA solution with scalability in mind to accommodate future expansion or upgrades, enabling seamless adaptation to evolving telecommunications standards and requirements.

- Regulatory Compliance: Ensure compliance with regulatory standards and certifications, such as FCC, ITU, and IEEE, to guarantee interoperability, compatibility, and legal compliance in telecommunications deployments.

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6. What is the process for return or replacement of XC3S200-5TQG144C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S200-5TQG144C we delivered, we will accept the replacement or return of the XC3S200-5TQG144C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S200-5TQG144C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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